Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling

Abstract

With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm2 and an HTC of 16.5 W(cm2·K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.

Symmetry of Structures under Two-Dimensional Instability in a Finite-Height Horizontal Layer of Boiling Liquid

“…A decrease in the void fraction in the layer on capillary-porous surfaces may relate to a decrease in the separation diameters of bubbles on these surfaces as compared to the smooth ones. A decrease in the separation diameters of bubbles during liquid boiling on porous surfaces relative to the data obtained on smooth samples is noted in many papers, for example [35][36][37][38]. According to the data from [39], bubbles rise according to the Stokes law when the rate of bubble rise increases with increasing bubble diameter d b ; this is observed up to Reynolds numbers of Re = 450.…”

An Overview of the Recent Advances in Pool Boiling Enhancement Materials, Structrure, and Devices

“…(iv) The enhanced heat transfer induced by the grooved surfaces usage was not merely due to the increased heat transfer area but also due to the situation of the grooves. Moreover, the authors Tang et al [116] studied the boiling heat transfer characteristics of multilayer micromesh copper surfaces and stated that these surfaces exhibited a considerable enhancement in the pool boiling heat transfer capability, including the critical heat flux, heat transfer coefficient, and onset of nucleate boiling, in comparison to those of a plain copper heating surface. The micropores formed by the multilayer micromeshes enhanced the heat transfer behavior via an extended surface area, increased the number of active nucleation sites, and ameliorated the capillary wicking effect.…”

Editorial for the Special Issue “Microsystem for Electronic Devices”

“…This Special Issue includes 12 high-quality papers focused on the development of microsystems. Half of the published papers focus on light-emitting diode (LED) microsystems and related microelectronic systems [4][5][6][7][8][9], three papers discuss the cooling techniques of electronic microsystems [10][11][12], and the final three papers present several mechanical microsystems [13][14][15].…”

“…On the cooling techniques of electronic microsystems, Chen et al [10] developed multilayer copper micro-meshes as pool boiling enhancers for commercial compact electronic cooling with a maximum critical heat flux of 207.5 W/cm 2 and a heat transfer coefficient of 16.5 W/(cm 2 •K) due to abundant micropores and capillary wicking, making them highly competitive for use in high-power cooling in commercial applications. The design and construction of microstructures in heat sinks has been shown to improve heat dissipation efficiency.…”