Porous Anodic Aluminum Oxide Interposer: Fabrication, Characterization, and Evaluation

Chan, Hing‐Yuen; Zhang, Zhihao; Bachman, Mark; Li, G.P.

doi:10.1149/2.0061901jss

Cited by 3 publications

(4 citation statements)

References 36 publications

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“…The three-dimensional model of the AAO-based microheater platform for the numerical simulation is illustrated in figure S3. The physical properties of the AAO substrate for the numerical simulation were employed from the previous research [22,[35][36][37][38][39], summarized in table S1. As a numerical simulation result, 24.0 mW was required for heating to 262 • C. The graph in figure 4(e) compares the power consumption-heating temperature relationships estimated by the RTD test and the numerical simulation, which shows proximity between these values.…”

Section: Resultsmentioning

confidence: 99%

Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor

Lee

Cho

Kang

et al. 2023

J. Micromech. Microeng.

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The semiconductor metal oxide (SMO) gas sensors are getting high attention owing to their high sensitivities and fast responses. They require high temperature for the reaction with target gases, and suspended silicon membrane microheaters are typically used to reduce the heating power consumption. However, they have low durability for long-term uses, and high probability of fracture by thermal stress or mechanical impact. In this study, as an alternative to the silicon membrane microheater, anodic aluminum oxide (AAO) based microheater platform gas sensor was fabricated for low power consumption and high thermal/mechanical stabilities. Nanoscale air gaps of the AAO substrate reduce the heat loss transferred to the substrate. Therefore, AAO-based microheater platforms do not require suspended structures sustained by very thin bridges, which dramatically enhances thermal/mechanical stabilities. The temperature of fabricated microheater platform reached to 250℃ by a heating power of 27.4 mW. The excellent thermal/mechanical stabilities of the AAO-based microheater platforms were verified by cyclic on-off and mechanical shock test. The pulsed heating operation was adopted, and it reduced the heating power consumption to 9 mW. The fabricated AAO-based gas sensors showed much higher responses to NO2 gas compared to the SiO2 membrane-based gas sensors.

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Section: Resultsmentioning

confidence: 99%

Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor

Lee

Cho

Kang

et al. 2023

J. Micromech. Microeng.

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“…Advanced interposer technology is crucial for developing highly integrated devices in packages for various applications, including custom electronics, the Internet of things, and sensors in smart factories. Interposer technology has evolved from multichip modules to Si and glass interposers; this evolution aims to simplify the manufacturing process, integrate different technologies into the interposer from vendors, and eventually decrease the overall cost . Silicon and glass interposers are characterized by several well-known limitations.…”

Section: Introductionmentioning

confidence: 99%

Mechanically Robust and Thermally Conductive Nano-Porous Anodic Aluminum Oxide Templates via Thermal Stress Minimization and Alpha Phase Transformation for Interposer

Yi¹,

Park

Shen³

et al. 2023

ACS Appl. Nano Mater.

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In the semiconductor industry, economical high-end interposer technologies with high thermal conductivity are in high demand. The recently reported anodic aluminum oxide (AAO) template has limitations of low mechanical strength and thermal conductivity due to the amorphous phase. In addition, AAO has microthickness and nanopores, and it is easy to break. In this study, the AAO template does not develop a microcrack at high temperature by controlling the pores on the front and back side of the same pore of the AAO, as concluded in the COMSOL simulation. The nonmicrocrack alpha-AAO template is mechanically robust with high thermal conductivity owing to thermal stress minimization and phase transformation (anodizing temperature and annealing treatment). In addition, anionic contamination components present on the surface of the alpha-AAO pores were removed by increasing the temperature, and the properties were investigated. The hardness and thermal conductivity of the alpha-AAO template (8.98 GPa and 13.7 W/(m·K)) were 3.3 and 6.7 times higher than those of bare-AAO (2.74 GPa and 2.08 W/(m·K)), respectively. Especially, the superior thermal conductivity of alpha-AAO was confirmed by a thermal imaging camera (TIC). The alpha-AAO template with enhanced hardness and thermal conductivity can potentially be used in various applications, such as semiconductor interposer materials and 6G wireless communication components.

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“…One promising material in particular, anodized aluminum oxide (AAO), has been explored for potential use in microelectronic applications. [1][2][3] While AAO material shows promise as a microelectronic material, a significant limitation is in metalizing the surface at low cost.…”

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confidence: 99%

“…These unique properz E-mail: melonmj0219@gmail.com ties have attracted research and work in porous AAO films for applications in nanowire fabrication, biomedical devices, [13][14][15] microelectromechanical systems (MEMs), microelectronics, interposers, and RF substrates. [1][2][3][16][17][18][19] In most cases, PVD has been used for depositing metal layers on the surfaces of AAO films. 1,[5][6][7]16 Metal layers on the surfaces of AAO are used for forming electrical traces, structural features, or etch masks.…”

mentioning

confidence: 99%

Direct Metal Layer Forming with Good Adhesion on Porous AAO Films by Electroless Cu Plating

Jinsenji

Tajiri

Nishimura³

et al. 2019

J. Electrochem. Soc.

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Porous anodic aluminum oxide (AAO) films have great potential for micro and nano fabrication. Development of metallization techniques for AAO films is necessary for AAO device fabrication. In this work, a process for electroless Cu plating on AAO films was investigated. A quick Pd 2+ removal process after activation improved the adhesion between plated copper (Cu) layer and AAO films. Since the Pd catalyst at the AAO top surface was effectively removed by a complex agent, the plating reaction started approximately 15-20 μm deep in the nanopores. The Cu was continuously deposited to the top of the nanopores and finally covered the AAO surface. The adhesion strength between the Cu films and AAO films measured by the 90°peeling test method was over 0.5 kN/m. Successful electroless Cu plating on AAO is an all-wet chemical batch process that does not require sophisticated fabrication facilities, and can be used as a low-cost metallization process for producing AAO microdevices.

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Porous Anodic Aluminum Oxide Interposer: Fabrication, Characterization, and Evaluation

Cited by 3 publications

References 36 publications

Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor

Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor

Mechanically Robust and Thermally Conductive Nano-Porous Anodic Aluminum Oxide Templates via Thermal Stress Minimization and Alpha Phase Transformation for Interposer

Direct Metal Layer Forming with Good Adhesion on Porous AAO Films by Electroless Cu Plating

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