“…Currently, in order to use the heat resistance and functions of ceramic materials, devices containing heterogeneous ceramics with ceramic/ceramic or metal/ceramic interfaces have been actively developed using cofiring [1,2], printing [3,4], and coating [5,6,7,8,9,10] processes in various industrials fields, including energy [11,12,13], automotive [14,15], and healthcare [16,17]. Since the target ceramic materials are rarely well-sintered at the desired position when sintered with other materials, the thermal expansion needs to be tailored by optimizing the process, adding complementary materials, or controlling the composition of the ceramic [18,19].…”