“…Due to its good reliability, bonding strength, submicron accuracy and production capacity, Nd:YAG micro-pulse laser welding is widely used in optical communication devices packaging. Different laser diode transceiver modules, i.e., To-Can-Type, Dual-in-Line-Type and Butterfly-Type laser diode modules [1][2][3], are packaged by Nd:YAG pulsed laser bonding. Despite the many advantages of pulse laser welding for micro joining, the rapid cooling and solidification in the weld pool introduces residual stress and post-weld shifting around the welded area, which results in poor coupling efficiency.…”