Postpolymerization of a Fluorinated and Reactive Poly(aryl ether): An Efficient Way To Balance the Solubility and Solvent Resistance of the Polymer

Abstract

A new fluorinated poly(aryl ether) with reactive benzocyclobutene groups as the side chain was successfully synthesized. This polymer showed a number-average molecular weight (Mn) of 200,000 and had good solubility and film-forming ability. After being postpolymerized at high temperature (>200 °C), the polymer film converted to a cross-linked network structure, which was insoluble in the common organic solvents. Such results suggest that the postpolymerization is an efficient way to achive the balance between the solubility and the solvent resistance of the polymer. TGA data showed that the postpolymerized polymer had a 5 wt % loss temperature at 495 °C and a residual of 61% at 1000 °C under N2. The cross-linked film also exhibited good dielectric properties with an average dielectric constant of about 2.62 in a range of frequencies from 1 to 30 MHz. With regard to the mechanical properties, the cross-linked film had hardness, Young's modulus, and bonding strength to a silicon wafer of 1.22, 8.8, and 0.89 GPa, respectively. These data imply that this new polymer may have potential applications in the electrical and microelectronics industry.

Preparation of planar and hydrophobic benzocyclobutene‐based dielectric material from biorenewable rosin

“…Moreover, the measurements show that the average surface roughness (Ra) of the cured resin is 0.337 nm within a 5.0 × 5.0 μm 2 area, and the Ra value of cured resin could be comparable to the reported BCB resins, such as fluorinated BCB resins, siloxane‐based BCB resins, and BCB resins containing bulk groups . It is well known that the BCB‐based resin exhibits good surface roughness, and the introduction of rosin did not affect the surface smoothness of the resin. We think rosin and BCB are both rigid structures, so they have a certain degree of compatibility.…”

“…The polymerization degree of the monomer was estimated from the DSC trace. After the resin was heated from 40 to 300 °C at 10 °C min −1 in N 2 , the DSC trace shows that no exothermic peak is observed, indicating complete polymerization …”

“…Hydrophobicity is a more important parameter for the application of high‐performance material in the electronics and microelectronics, because it governs moisture adsorption and deterioration of dielectric properties . The hydrophobicity of the cured resin was investigated using contact angle tests with deionized water.…”

“…Generally, the resulting BCB resins show excellent dielectric properties and thermal stability, low water absorption and thermal expansion coefficient . Correspondingly, BCB resins have been widely used in aerospace, electronics and microelectronics, in applications such as enameled wire varnish, large‐scale integrated circuits, and composite materials …”

A Novel Thermo‐Polymerizable Aromatic Diamine: Synthesis and Application in Enhancement of the Properties of Conventional Polyimides

“…In this case, the thermo‐polymerizable groups formed crosslinking networks in the polymers. These crosslinked networks endowed the polymers with high thermostability and good solvent resistance . It was found in our cases that the benzocyclobutene moiety was a suitable crosslinking group for the postpolymerization of the polymers due to its bulky volume and high reactivity.…”