2020
DOI: 10.1155/2020/3865752
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Postprocessing Study for the Controllable Structures of Ceramic Green Parts Realized by a Flexible Binder Jetting Printing (BJP) Solution

Abstract: For indirect ceramic additive manufacturing (AM), green parts’ initial densities are low, limiting the postprocessing strengthening under atmospheric pressure. This study employed binder jetting printing (BJP) based on the polycondensation curing of urea-formaldehyde resin to produce series of Al2O3 green specimens with controllable structures. Further, an integrated postprocessing procedure, including the sequential stages of presintering, ceramic slurry infiltration, and final sintering, was conducted on the… Show more

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Cited by 18 publications
(3 citation statements)
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“…It allows, in principle, to produce parts from almost any powdered feedstock material, from metals to ceramics, since there are no restrictions regarding high melting points, reflectivity, etc. [8][9][10][11][12][13][14]. Considering that the printing process is performed at room temperature, no effect about thermal conductivity needs to be considered and concerns like presence of residual stresses, part distortions or crack formation are significantly reduced.…”
Section: Introductionmentioning
confidence: 99%
“…It allows, in principle, to produce parts from almost any powdered feedstock material, from metals to ceramics, since there are no restrictions regarding high melting points, reflectivity, etc. [8][9][10][11][12][13][14]. Considering that the printing process is performed at room temperature, no effect about thermal conductivity needs to be considered and concerns like presence of residual stresses, part distortions or crack formation are significantly reduced.…”
Section: Introductionmentioning
confidence: 99%
“…At the same time, in order to avoid defects during the debinding process, heat preservation was carried out at 450 °C for 30 min. In order to make sure that the green body has sufficient strength in the subsequent process, the pre-sintering was carried out immediately after the debinding, and the temperature of pre-sintering was 1650 °C [ 20 ]. Finally, the C/SiC preform was prepared, named P0.…”
Section: Methodsmentioning
confidence: 99%
“…Among these techniques, the most important are Stereolithography (SLA) [5][6][7], Material Extrusion (e.g. Fused Deposition Modeling) [8][9][10], Robocasting/Direct Ink Writing (DIW) [11][12][13]) and Binder Jetting (BJ) [14][15][16][17].…”
Section: Introductionmentioning
confidence: 99%