Potential of Transition Metal Dichalcogenide Transistors for Flexible Electronics Applications

Abstract

Semiconducting transition metal dichalcogenides (TMDC) are 2D materials, combining good charge carrier mobility, ultimate dimension down‐scalability, and low‐temperature integration. These properties make TMDCs interesting for flexible electronics, where the thermal fabrication budget is strongly substrate limited. In this perspective, an overview of the state of TMDC research is provided by evaluating two scenarios, both with their own merit depending on the target application. First, high‐quality chemically grown 2D TMDCs are promising for nanoscale high‐performance and high‐frequency devices with excellent gate control and high current on/off ratios. Second, TMDC thin films can also be solution deposited from chemically exfoliated flakes allowing for moderate performance, but providing a path toward low‐cost production. A strong advantage of TMDCs is the possibility to realize p‐type and n‐type channels for complementary transistors having similar performance figures‐of‐merit. This aspect, as well as common transistor performance metrics are also compared with other flexible channel materials providing an overview of the state of the art of thin‐film transistors in the field of flexible electronics.

Synergistic Effects of UV Irradiation on a Flexible Ag/NCQDs-MoS2/Ag/Kapton Resistive-Switching Memory Device

“…Current technological advances offer various substrates and materials to fabricate flexible devices. Recently, two-dimensional (2D) layer materials such as molybdenum disulfide (MoS 2 ) have gained a lot of interest in modern device development due to their excellent flexibility, high mechanical strength, tunable band gap, and optical characteristics. − However, it has been discovered that MoS 2 thin films have in-plane mechanical stiffness comparable to steel, making it an intriguing material for various flexible applications. , In this regard, polyimides such as Kapton have garnered considerable attention due to their unique properties, particularly low Young’s moduli. Furthermore, Kapton demonstrates a high adhesion energy, providing a strong bond for excellent adhesion with thin films. , …”

Direct Transfer of Monolayer MoS2 Device Arrays for Potential Applications in Flexible Electronics

“…Two-dimensional (2D) transition metal dichalcogenides (TMDCs) exhibit a wide range of semiconducting properties, making them potential candidates for low-power electronic device applications in the limit of atomic thickness . Owing to their van der Waals (vdW) layered structure, wide band gap variability, high mechanical flexibility, and controllable optoelectronic response, , the TMDCs are the emerging future materials in the front end of line (FEOL) technologies. − Moreover, their possible utilization in the back end of line (BEOL) integration , and Internet of Things (IoT) , based embedded sensors require cost-effective synthesis and substrate-to-substrate transfer of channel materials with robust device fabrication. Chemical vapor deposition (CVD) is one of the most explored synthesis routes to produce large-scale and high-quality monolayer 2D semiconductors such as MoS 2 .…”

Applicability of the MoS2–aSiC Heterostructure for Durable Supercapacitance and NO2 Gas Sensing in a Harsh Environment

“…The sulfur atoms form a hexagonal lattice, with molybdenum atoms occupying the octahedral sites . It exhibits high electron mobility and possesses a robust and stable monolayer structure, enabling its integration into nanoscale devices . This unique layered structure gives MoS 2 its characteristic properties, including its semiconducting behavior and mechanical flexibility.…”

“…45 stable monolayer structure, enabling its integration into nanoscale devices. 46 This unique layered structure gives MoS 2 its characteristic properties, including its semiconducting behavior and mechanical flexibility. Due to its two-dimensional, abundant, and nontoxic nature, it is widely used in gassensing, photodetection, and energy harvesting and storage applications.…”