Potentiometric determination of dimethylamine borane and hypophosphite

Schmeckenbecher, Arnold F.; Lindholm, Jerry

doi:10.1021/ac60252a036

Cited by 8 publications

(5 citation statements)

References 6 publications

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“…In this article, we systematically investigate the effect of amine borane reducing agents on Cu electroless deposition on −CH 3 -, −COOH-, and −OH-terminated SAMs. In ELD, amine borane reducing agents are very versatile ,,, and can be used to deposit metals including gold, , nickel, ,,, silver, cobalt, , palladium, , iron, copper, alloys, ,, semiconductors, , and insulators . Other advantages of amine borane reducing agents include their ability to produce relatively pure metallic films, their wide range of operating conditions, and their reduced environmental impact .…”

Section: Introductionmentioning

confidence: 99%

Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs

Ellsworth

Walker

2017

Langmuir

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Metallized organic layer constructs have a wide range of technological applications. Electroless deposition is an attractive technique by which to deposit metal overlayers because it is inexpensive and can be performed at low temperatures, compatible with organic materials. Amine borane reducing agents are versatile and are capable of depositing metals, semiconductors, and even insulators. We have investigated the role of amine borane reducing agents in the electroless deposition of copper on -CH-, -OH-, and -COOH-terminated SAMs adsorbed on gold using time-of-flight secondary ion mass spectrometry, optical microscopy, and complementary MP2 calculations. Three reducing agents were studied: amine borane, dimethylamine borane, and trimethylamine borane. At pH >9, -COOH-terminated SAMs form copper-carboxylate complexes, which serve as nucleation sites for subsequent copper deposition. The rate of copper deposition is dependent on the strength of the B-N bond of the amine borane reducing agent. Similarly, if the terminal group is nonpolar such as a -CH functionality, then the rate of copper deposition is dependent on the amine borane B-N bond strength. However, in contrast to -COOH-terminated SAMs, copper deposition does not begin immediately. If the terminal group contains polar bonds, such as the C-OH bond of -OH-terminated SAMs, deposition is dominated by the interaction of the reducing agent with the terminal group rather than the relative bond strengths of the amine borane reducing agents.

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Section: Introductionmentioning

confidence: 99%

Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs

Ellsworth

Walker

2017

Langmuir

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“…This is because DMAB is a versatile reducing agent which can be used to deposit a wide range of materials. (2,(20)(21)(22)(23) ENDOM can also be employed using other acid/base or ionic reducing agents, for example sodium borohydride,(20) which allows greater synthetic flexibility. Additionally, semiconducting nanowires can be deposited using chemical bath deposition in a similar manner to ENDOM, and so even more types of nanowires can be deposited.…”

Section: Discussionmentioning

confidence: 99%

Towards Molecular Electronics: Using Solution-Based Methods to Deposit Nanowires

Ellsworth¹,

Borner²,

Yang³

et al. 2014

ECS Trans.

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Electroless nanowire deposition on micropatterned substrates (ENDOM) is a promising technique by which to direct the growth of nanowires. Cu, Pd, Ni and Ag nanowires have been grown on patterned -OH/-CH 3 SAMs by exploiting the different reaction rates of electroless deposition on -CH 3 and -OH terminated SAMs. Initially the nanoparticles nucleate at the interface of the -CH 3 and -OH terminated SAMs, which coalesce into a polycrystalline, uniform nanowire. The dimensions of the deposited nanowires are controlled by the reagent concentrations, deposition bath pH, deposition temperature, deposition time and identity of the reducing agent. Finally we demonstrate that chemical bath deposition can also be used to direct the growth of semiconducting nanowires in a similar process to ENDOM.

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“…Both papers report standard potentials for the couples. Schmeckenbecher and Lindholm (232) employed a palladium electrode in the potentiometric titration of dimethylamine borane and hypophosphite. A PdCl2 and FeCl2 mixture was titrated with dimethylamine borane and hypophosphite solutions.…”

Section: Electrodesmentioning

confidence: 99%

Potentiometric titrations

Toren¹

1968

Anal. Chem.

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The literature covered in this review includes recent developments which became available since the review by Roe (221) and continues through the literature reported in Chemical Abstracts through November 20,1967.Potentiometric titrations and potentiometry were reviewed by Banick (15), Gross and Murray (88), and Hilton (105). Acid-base titrations and pH measurements were reviewed by Bates (16), Hahn (91), and Wimer (281). Redox titrations were reviewed by Strickman (256) and Headridge, Pierce, and Anderson (96). Electrode sign conventions were briefly treated by Van Rysselberghe et al. (269).

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Potentiometric determination of dimethylamine borane and hypophosphite

Cited by 8 publications

References 6 publications

Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs

Role of the Reducing Agent in the Electroless Deposition of Copper on Functionalized SAMs

Towards Molecular Electronics: Using Solution-Based Methods to Deposit Nanowires

Potentiometric titrations

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