Powder blasting patterning technology for microfabrication of complex suspended structures in glass

Pawlowski, A.-G.; Belloy, E.; Sayah, A.; Gijs, Martin A. M.

doi:10.1016/s0167-9317(03)00114-x

Cited by 37 publications

(21 citation statements)

References 13 publications

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“…Several other methods have been used for patterning glass in microfluidic applications. Through-glass holes for fast prototyping can be achieved using sand-blasting, 79 laser-drilling, 80 electrochemical discharge, 81 or drilling with diamond beads. 82 For silicon, well-dimensioned through-holes aligned within a few micrometers can be achieved using a deep RIE process.…”

Section: Through-holes For Fluid Portsmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

311

207

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This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow. I. WHY USE SILICON AND GLASS IN MICRO-AND NANO-FLUIDIC APPLICATIONS?Micro-and nano-fluidic technology continues to be embraced by biologists, 1-3 chemists, 4 and engineers throughout academia and industry. As its applications have expanded, there has been an explosion in the range of materials and processes used to fabricate these devices. The earliest microfluidic devices (e.g., gas 5 and liquid 6 chromatography devices) were made from silicon and glass and borrowed processes directly from semiconductor and microelectromechanical systems (MEMS) manufacturing. 7 Now, however, many researchers have moved away from silicon and glass, and instead use cast elastomers such as polydimethylsiloxane (PDMS)-which is ideal for swift prototyping-or thermoplastic polymers, which can be hot-embossed or injection-molded and are well suited to inexpensive manufacturing. Yet, there remain many applications where glass and silicon offer advantages over polymeric materials. In this paper, we highlight these advantages and offer a framework for selecting fabrication processes when using silicon and glass. A. The dominance of soft lithographyOver the last decade, PDMS has become virtually the default material for forming microfluidic devices, 8 because of the sheer ease with which it can be cast on to a micro-scale mould and then strongly bonded to glass. 9 The elastomeric nature of the material has been exploited to integrate fluidic valves and pumps on-chip and has simplified the production of multi-layer devices because the soft layers readily conform to each other. 10,11 Yet, the low stiffness (usually <1 MPa) of PDMS relative to amorphous thermoplastics, silicon, and glass has its own a) Authors to whom correspondence should be addressed. Electronic addresses: ciliescu@ibn.a-star.edu.sg and hkt@ntu.edu.sg. 6, 016505 (2012) drawbacks. High aspect-ratio channels are notoriously difficult to fabricate in PDMS because of their propensity to collapse. 12 Moreover, difficulties in automating the handling of such a soft material have hampered efforts to scale up PDMS device manufacturing. Meanwhile, PDMS's high oxygen and water permeabilities have proved both a blessing and a curse in different applications.The hydrophobic nature of PDMS can be an important consideration for some biological applications. In drug screening applications, for example, hydrophobic drugs as well as metabolites (urea or albumin) can be absorbed into the device's material due to hydrophobic--hydrophobic interaction...

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Section: Through-holes For Fluid Portsmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

311

207

View full text Add to dashboard Cite

show abstract

“…The silicon wafer is patterned through a single DRIE, while the glass is patterned by a novel micro-sandblasting method [33] offered by Icoflex 9 . Unlike with silicon, deep high-aspect ratio patterning of glass is challenging.…”

Section: Silicon O Xide Resistmentioning

confidence: 99%

Microfabricated electrospray emitter arrays with integrated extractor and accelerator electrodes for the propulsion of small spacecraft

Dandavino¹,

Ataman²,

Ryan³

et al. 2014

J. Micromech. Microeng.

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Microfabricated electrospray thrusters could revolutionize the spacecraft industry by providing efficient propulsion capabilities to micro and nano satellites (1–100 kg). We present the modeling, design, fabrication and characterization of a new generation of devices, for the first time integrating in the fabrication process individual accelerator electrodes capable of focusing and accelerating the emitted sprays. Integrating these electrodes is a key milestone in the development of this technology; in addition to increasing the critical performance metrics of thrust, specific impulse and propulsive efficiency, the accelerators enable a number of new system features such as power tuning and thrust vectoring and balancing. Through microfabrication, we produced high density arrays (213 emitters cm−2) of capillary emitters, assembling them at wafer-level with an extractor/accelerator electrode pair separated by micro-sandblasted glass. Through IV measurements, we could confirm that acceleration could be decoupled from the extraction of the spray—an important element towards the flexibility of this technology. We present the largest reported internally fed microfabricated arrays operation, with 127 emitters spraying in parallel, for a total beam of 10–30 µA composed by 95% of ions. Effective beam focusing was also demonstrated, with plume half-angles being reduced from approximately 30° to 15° with 2000 V acceleration. Based on these results, we predict, with 3000 V acceleration, thrust per emitter of 38.4 nN, specific impulse of 1103 s and a propulsive efficiency of 22% with <1 mW/emitter power consumption.

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“…The latter has through-wafer holes created by powder blasting (Fig. 2c) [19]. In this process, the Pyrex surface, which is protected with a photolithographically defined polymer mask, is eroded by a jet of alumina particles with a diameter of 30 m. The etch-rate of Pyrex achieved in static mode is 50 m/s.…”

Section: Fabricationmentioning

confidence: 99%

Micromachined chip-scale plasma light source

Carazzetti

Renaud

Shea

2009

Sensors and Actuators A: Physical

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a b s t r a c tWe report on the microfabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity containing interdigitated Aluminum electrodes. When the electrodes are powered through an impedance matching circuit, these devices have been used to generate stable millimeter-size RF plasma discharges operating continuously for over 24 h in He or Ar at pressures ranging from 10 to 500 mbar at RF powers of 300-1500 mW.

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Powder blasting patterning technology for microfabrication of complex suspended structures in glass

Cited by 37 publications

References 13 publications

A practical guide for the fabrication of microfluidic devices using glass and silicon

A practical guide for the fabrication of microfluidic devices using glass and silicon

Microfabricated electrospray emitter arrays with integrated extractor and accelerator electrodes for the propulsion of small spacecraft

Micromachined chip-scale plasma light source

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