Power-CAD: A novel methodology for design, analysis and optimization of Power Electronic Module layouts

A fast universal power module layout method

“…The performance of the optimized layout was assured better than the initial designs. With the presented design procedure, it is 9 times faster than the method in [6]. As shown in Fig.…”

“…12). Boundary element method based parasitic parameter calculation is utilized for fitness evaluation in [6] and it is the main cause for low speed with a large die number. To increase the optimization speed, the current conducting length is used to represent parasitic resistance and the surrounded area is used to represent the parasitic inductance [5].…”

“…In [6], along with a design example, an automatic design method by using a genetic algorithm (GA) was presented. The whole design space can be better searched.…”

Modeling method for electrothermal cosimulation of high‐power IGBT

“…However, the model is complex and difficult to run for a long time. In addition, some researchers attempted to extend widely used electrical simulators (e.g., Spice, Saber) to power semiconductors for electrothermal simulations by introducing lumped thermal impedance [15,16]. However, the precision of this method depends on the accuracy of both the circuit model itself For the application under transient overload extreme conditions, this article proposed a novel method of electrothermal cosimulation for high-power IGBT.…”

A temperature-dependent thermal model of IGBT modules suitable for circuit-level simulations

“…These models are simple, time efficient, and can be easily integrated in various circuit simulators (e.g. PLECS, Spice, Saber) [6]- [8]. However, there is still a deficiency for current Cauer and Foster models.…”