Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture

Zhu, Lingjun; Ta, Tuan; Liu, Rossana; Mathur, Rahul; Xu, Xiaoqing; Das, Shidhartha; Kaul, Ankit; Rico, Alejandro; Joseph, Douglas J.; Cline, Brian; Lim, Sung Kyu

doi:10.1109/islped52811.2021.9502481

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Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture

Cited by 8 publications

References 8 publications

System technology co-optimization and design challenges for 3D IC

System technology co-optimization and design challenges for 3D IC

Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package

Co-design of Thermal Management with System Architecture and Power Management for 3D ICs

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