2019
DOI: 10.1016/j.microrel.2019.113466
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Power GaN FET boards thermal and electromagnetic optimization by FE modeling

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Cited by 4 publications
(4 citation statements)
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“…The GS61004B device was composed of contact pads, bottom-side of the device package, source, gate, drain electrodes, p-GaN contact, AlGaN buffer layer, 2DEG channel, GaN buffer layer, Si substrate, and substrate. [28][29][30][31] In previous studies on the GaN HEMTs, the complex equivalent circuit models based on the S-parameter method were established. [32][33][34][35] In these previous studies, the complex equivalent circuit models have been applied to design radio-frequency (RF) power amplifiers, cold-filed-effect transistor mixers, multipliers, and microwave circuits; these devices were operated at the giga-Hertz; furthermore, the small-and large-signal analyses and measurements could be implemented.…”
Section: Complex Equivalent Circuit Of Gan Hemtmentioning
confidence: 99%
See 1 more Smart Citation
“…The GS61004B device was composed of contact pads, bottom-side of the device package, source, gate, drain electrodes, p-GaN contact, AlGaN buffer layer, 2DEG channel, GaN buffer layer, Si substrate, and substrate. [28][29][30][31] In previous studies on the GaN HEMTs, the complex equivalent circuit models based on the S-parameter method were established. [32][33][34][35] In these previous studies, the complex equivalent circuit models have been applied to design radio-frequency (RF) power amplifiers, cold-filed-effect transistor mixers, multipliers, and microwave circuits; these devices were operated at the giga-Hertz; furthermore, the small-and large-signal analyses and measurements could be implemented.…”
Section: Complex Equivalent Circuit Of Gan Hemtmentioning
confidence: 99%
“…The physical configuration is depicted in Figure 6A. The GS61004B device was composed of contact pads, bottom‐side of the device package, source, gate, drain electrodes, p ‐GaN contact, AlGaN buffer layer, 2DEG channel, GaN buffer layer, Si substrate, and substrate 28–31 …”
Section: Complex Equivalent Circuitmentioning
confidence: 99%
“…This device is composed of a contact pad, bottom-side of the chip package, source, gate, drain, source electrodes, p-GaN contact, AlGaN buffer layer, 2DEG channel, GaN buffer layer, Si substrate, and substrate. [21][22][23][24] The equivalent circuit model of the GaN HEMT included intrinsic and extrinsic elements, [25][26][27][28] as shown in Figure 2B. The intrinsic elements included the capacitance C ds , resistances R gs and R ds , and dependent current source g m v cgs ; g m was the transconductance and v cgs was the across voltage on C gs .…”
Section: Equivalent Circuit Model Of Laser Diodementioning
confidence: 99%
“…Figure 3a illustrates the physical package configuration, and Figure 3b is the GaN HEMT equivalent circuit. The electrical components included a substrate, Si substrate, GaN buffer layer, two-dimensional electron gas channel, AlGaN buffer layer, p-GaN contact, gate, drain, source electrodes, the bottom of the chip package, and contact pads [22,23]. The equivalent circuit of the GaN HEMT had intrinsic and extrinsic parts, as shown in Figure 3b [ [24][25][26][27].…”
Section: Gan Hemtmentioning
confidence: 99%