Power Integrity and Shielding Effectiveness Modeling of Grid Structured Interconnects on PCBs

Abstract

Abstract-In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-packageintegrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

Analysis of Signal Transmission Characteristics on Meshed Ground Plane

“…In applications of wireless communications, research on resonance and radiation patterns for the meshed ground plane has been carried out. Several studies have been published that it increases near-field coupling and far-field emission [5][6][7][8][9]. However, in this paper, we analyze the effect of signal integrity and power integrity on PCB as the mesh size changes on the ground plane.…”

Signal/Power Integrity Analysis of High-Speed Memory Module with Meshed Reference Plane

“…Recently, miniaturization and high-integration in the electronic systems have caused various problems in signal integrity and power integrity [1][2][3]. As the signal is transmitted at high-speed, problems such as crosstalk and reflection may occur in the electronic system and then these can degrade its signal quality.…”

A Channel Model of Scaled RC-dominant Wires for High-Speed Wireline Transceiver Design

“…Fig. 1 depicts interconnect scaling trend as integration technology evolves from system on printed-circuit-board (PCB) [5] through system-in-a-package (SiP) to systemon-a-chip (SoC) [6]. Distances between modules and thus the lengths of wires shrink as integration density increases.…”