Power Package Typical Assembly Process

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

“…The failure mainly occurs at the corners of the interface between the die and DA layer (see Fig. 1) in a typical COB or DAC package [4,5], thus, the region near the corner point at DA/die interface is taken as the critical location. The finite element analyses are focusing on the thermomechanical behavior of the DA layer near the corner point.…”

“…Heterogeneity and associated integration are far-reaching and can relate to materials, component type, circuit type, node, interconnect method, and source or origin. HI also provides significant advantages to power delivery devices, as it permits the integration of wide bandgap (WBG) power devices, e.g., SiC, with silicon control, logic, and memory devices, and with evolving passive devices [4].…”

“…The bonded interfaces are subjected to thermal stresses caused by the variation of temperature during operation, due to the different coefficients of thermal expansion (CTE). The thermomechanical stresses cause the degradation of the weaker interfaces or components of the integrated system, leading to device failure [4][5][6][7][8][9][10][11]. With SiC chip(s), which can sustain higher junction temperature, much more severe thermal stress could be induced.…”

“…Thermomechanical modeling helps to locate the regions that are most prone to failure, and compare and quantify reliability offered by different integration designs. The role and influence of thermomechanical modeling have been extensively studied [4][5][6][7][8][9][10]12]. A linear elastic finite element analysis is generally a first step to approximately estimate the stress and deformation behavior.…”

“…Zhang et al [28] calculated the average creep strain energy density accumulation on the whole micro bump. Although many studies have been conducted on solder ball volume averaging, few studies have reported how to select volume layers for large area die attach (DA) reliability in power electronic packaging [4].…”