Power scaling of laser diode modules using high-power DBR chips

Low‐Temperature Synthesis of Silicon Oxynitride‐Doped Si for Tunable Bragg Gratings Homogeneously Deposited on Si, SiO2, and Borosilicate Substrates and the tip of SM and PM Optical Fibers

“…Furthermore, one of the fabricated BGs called BG@915 has a central reflection wavelength at 915 nm and was also grown on a SiO 2 substrate that has particular importance in combining diode lasers, high‐power lasers, and multispectral lasers operated for 1‐micron applications. [ 21–23 ] Both the application wavelengths such as pump wavelengths of 915 and 976 nm utilized in the generation of 1‐micron lasers and the substrates that must be durable at high‐power applications are critical for long‐term and safe operation of the BGs. Watt‐level reflection of laser light from BG@915 was tested at the wavelength of 976 nm acquired from a Yb‐doped fiber laser.…”

In-fiber stabilization of high-power blue multiemitter modules

“…These requirements are typically not fulfilled by high power laser diodes, which commonly use a Fabry-Perot configuration, although some limited exceptions using a DBR configuration have been reported in the literature. 9 The solution is to spectrally stabilize the laser diodes before their wavelength combination. Spectral stabilization is obtained using an external narrow-band reflector that dominates over the laser intrinsic cavity.…”

“…Leveraging on previous experience in inscribing FBGs in multimode fibers 10 and on the blue laser multiemitter design and assembly capabilities, 11,12 this paper reports the preliminary experimental validation of the stabilization of HPBL diodes using femtosecond laser inscribed FBGs.…”

High-power multi-emitter modules with fiber Bragg grating stabilization

“…As for high-power diodes, the stabilization is way less common and it has been obtained through external discrete components, such as Volume Bragg Gratings (VBGs), or by developing special highpower DFB chips. 7 The use of VBGs requires the positioning of additional components in the multi-emitter, with all the related alignment errors and corresponding mitigation techniques already analyzed for other discrete components, such as the collimating lenses. [8][9][10] Besides, it requires additional assembly time, with consequent reduction of the process throughput.…”