Power-supply decoupling on fully populated high-speed digital PCBs

Ricchiuti, V.

doi:10.1109/15.974649

Cited by 54 publications

(24 citation statements)

References 13 publications

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“…This type of electromagnetic disturbance (noise), also known as delta-I noise or power/ground plane bounce, has been discussed intensively over the last decade and different approaches have been used to maintain a noise-free PDS. Most prominent of these involve the use of discrete decoupling capacitor and embedded capacitance [3], [4]. However, the method of decoupling capacitors fails when operated at high frequency due to the inherent lead inductance of capacitors.…”

Section: Introductionmentioning

confidence: 99%

Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits

Qin

Ramahi

Granatstein

2007

IEEE Trans. Electromagn. Compat.

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Abstract-Planar electromagnetic bandgap (EBG) structures with novel meandered lines and super cell configuration are proposed for mitigating simultaneous switching noise propagation in high-speed printed circuit boards. An ultrawide bandgap extending from 250 MHz to 12 GHz and beyond is demonstrated by both simulation and measurement, and a good agreement is observed. These perforated EBG-based power planes may cause spurious and unwanted radiation. In this paper, leakage radiation through these imperfect planes is carefully investigated. It is found that the leakage field from these planar EBG structures is highly concentrated around the feed point, and the field intensity is attenuated dramatically when passing across several periods of patches. A novel concept of using these EBG structures for electromagnetic interference reduction is also introduced. Finally, the impact of power plane with EBG-patterned structures on signal integrity is studied. Index Terms-Electromagnetic bandgap (EBG), electromagnetic interference (EMI), signal integrity (SI), simultaneous switching noise (SSN).

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Section: Introductionmentioning

confidence: 99%

Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits

Qin

Ramahi

Granatstein

2007

IEEE Trans. Electromagn. Compat.

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“…is a limiting factor for local decoupling in (3). When its value is considerably greater than , which sometimes is true for a PCB with many layers or interior power/ground layers, the noise mitigation benefit of local decoupling is negligible.…”

Section: Modeling Shared-via Decouplingmentioning

confidence: 99%

“…Therefore, the mutual inductance between them, , can be approximated as , where is the coupling coefficient, and the mutual inductive coupling between the loop portions outside the power/ground pin via is neglected. In this case, (2) can be further simplified as dB (3) The potential benefits of local decoupling can then be extracted from (3). In particular the relevant factors are the mutual coupling between the local decoupling capacitor and IC vias and the ratio of the portion of the interconnect inductance above the planes, relative to that in the planes.…”

Section: Power Bus Noise Reduction Duementioning

confidence: 99%

“…Approaches that demonstrate the benefits of maintaining closely spaced power and ground layers for minimizing power bus noise have been reported, [3], [4] and are becoming a matter of design experience and practice. SMT decoupling capacitors are commonly used in dc power bus design to mitigate high-frequency noise on the dc power bus [5], [6].…”

Section: Introductionmentioning

confidence: 99%

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Estimating the noise mitigation effect of local decoupling in printed circuit boards

Fan

Cui

Drewniak

et al. 2002

IEEE Trans. Adv. Packag.

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Abstract-Local decoupling, i.e., placing decoupling capacitors sufficiently close to device power/ground pins in order to decrease the impedance of power bus at frequencies higher than the series resonant frequency, has been studied using a modeling approach, a hybrid lumped/distributed circuit model established and an expression to quantify the benefits of power bus noise mitigation due to local decoupling developed. In this work, a test board with a local decoupling capacitor was studied and the noise mitigation effect due to the capacitor placed adjacent to an input test port was measured. Closed-form expressions for self and mutual inductances of vias are developed, so that the noise mitigation effect can then be estimated using the previously developed expression. The difference between the estimates and measurements is approximately 1 dB, which demonstrates the application of these closed-form expressions in the PCB power bus designs. Shared-via decoupling, capacitors sharing vias with device power/ground pins, is also modeled as an extreme case of local decoupling.Index Terms-Closed-form expressions for via inductances, estimation of power-bus noise reduction due to local decoupling, local decoupling, mutual inductance, printed circuit board layer stackup, shared-via decoupling.

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“…Embedded capacitance could be an effective alternative to the discrete decoupling capacitors [2] [3]. This method makes full use of the power and ground planes of the PCB to form an embedded capacitance [4].…”

Section: Introductionmentioning

confidence: 99%

Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes

Zheng¹,

Mathewson²,

O’Flynn³

et al. 2010

2010 12th Electronics Packaging Technology Conference

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Access to the full text of the published version may require a subscription. Rights AbstractIn this paper, the embedded capacitance material (ECM) is fabricated between the power and ground layers of the wireless sensor nodes, forming an integrated capacitance to replace the large amount of decoupling capacitors on the board. The ECM material, whose dielectric constant is 16, has the same size of the wireless sensor nodes of 3cm*3cm, with a thickness of only 14µm. Though the capacitance of a single ECM layer being only around 8nF, there are two reasons the ECM layers can still replace the high frequency decoupling capacitors (100nF in our case) on the board. The first reason is: the parasitic inductance of the ECM layer is much lower than the surface mount capacitors'. A smaller capacitance value of the ECM layer could achieve the same resonant frequency of the surface mount decoupling capacitors. Simulation and measurement fit this assumption well. The second reason is: more than one layer of ECM material are utilized during the design step to get a parallel connection of the several ECM capacitance layers, finally leading to a larger value of the capacitance and smaller value of parasitic. Characterization of the ECM is carried out by the LCR meter. To evaluate the behaviors of the ECM layer, time and frequency domain measurements are performed on the powerbus decoupling of the wireless sensor nodes. Comparison with the measurements of bare PCB board and decoupling capacitors solution are provided to show the improvement of the ECM layer. Measurements show that the implementation of the ECM layer can not only save the space of the surface mount decoupling capacitors, but also provide better powerbus decoupling to the nodes. IntroductionNoise on the power bus caused by a rapid current change is a common problem in high speed PCB design [1]. Decoupling capacitors are commonly used to mitigate the power supply noise. Typically the surface mount (SMT) capacitors are used for decoupling. The huge amounts of the SMT capacitors not only take up circuit space but also increase the design difficulty and unreliability. Moreover, the working frequency of the SMT capacitors is limited due to the parasitic inductance brought by the interconnection.Embedded capacitance could be an effective alternative to the discrete decoupling capacitors [2] [3]. This method makes full use of the power and ground planes of the PCB to form an embedded capacitance [4]. To improve the capacitance density, the thickness of the dielectric material is decreased and the high dielectric constant material is selected [5]. There are many publications to characterize the impedance and other parameters of the PCB with embedded capacitance [6] [7] and its applications [8] [9]. However, there are very few applications to use the embedded capacitance material in the

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Power-supply decoupling on fully populated high-speed digital PCBs

Cited by 54 publications

References 13 publications

Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits

Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits

Estimating the noise mitigation effect of local decoupling in printed circuit boards

Design and implementation of the embedded capacitance layers for decoupling of wireless sensor nodes

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