PowerSynth-Guided Reliability Optimization of Multi-Chip Power Module

Razi, Imam Al; Huitink, David; Peng, Yarui

doi:10.1109/apec42165.2021.9487161

Cited by 3 publications

(3 citation statements)

References 16 publications

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“…Against the backdrop of the increasing demand for intelligence in high-tech fields such as the military, aerospace, computer, communication, and automotive industries, the Multi-chip Module (MCM) has been favored as a new technology that breaks through the inherent bottlenecks of traditional packaging due to its high performance, miniaturization, and high reliability [1][2][3][4]. However, due to the continuous increase in power consumption within integrated circuits, the heat issue in MCM is becoming increasingly prominent.…”

Section: Introductionmentioning

confidence: 99%

Automatic Optimization System for Heat Source Layout of Multi-Chip Components Based on Multi-Software Integration

Huang,

Hu,

et al. 2024

Applied Sciences

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This paper presents an automatic optimization system for the heat source layout of multi-chip modules, referred to as IOS. The system aims to optimize the heat source layout of multi-chip modules through the integration of multiple software tools. The IOS utilizes an optimization algorithm, WINDOW DOS, and other methods to achieve this goal. Initially, two optimization strategies are introduced which are utilized in conjunction with the Non-dominated Sorting Genetic Algorithm-II(NSGA-II). Subsequently, a simplified thermal model of the multi-chip module is applied to the IOS. The automatic optimization module is then used to optimize the heat source layout. In the end, we simulated and analyzed the application results. The simulation analysis reveals that when the temperature extreme value index is optimized, the PCB board’s transient temperature range falls within [343.14 K, 344.09 K]. Similarly, when the temperature homogeneity index is optimized, the PCB board’s transient temperature range falls within [343.39 K, 344.21 K]. Comparing these results with the experience layout, the temperature difference is reduced by 76.36% and 79.60%, respectively. The optimization results demonstrate that the IOS has a significant impact, offering remarkable optimization effects, low cost, high efficiency, and a more uniform temperature distribution. These findings indicate that the IOS holds promising potential for applications and provides value in optimizing the heat source layout of multi-chip modules.

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Section: Introductionmentioning

confidence: 99%

Automatic Optimization System for Heat Source Layout of Multi-Chip Components Based on Multi-Software Integration

Huang,

Hu,

et al. 2024

Applied Sciences

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show abstract

“…Power modules have a variety of practical applications, from use in electric vehicles to personal computers. As technology continues to improve and the demand for higher-density sources of power increases, researchers are currently continuing to look for ways to optimize power module designs [1]. A typical multi-chip power module structure consists of a base plate, an insulating substrate, bonding materials, power semiconductor chips, power interconnections, encapsulant, and a case.…”

Section: Overview Of Power Module Design Flowmentioning

confidence: 99%

“…This difficult yet incredibly important decision often leads to student dissatisfaction and career anxiety [1]. Changing majors can be extremely difficult to impossible in some cases, perhaps best represented by some schools utilizing an actual lottery for which students are allowed to change majors due to excessive demand for popular fields.…”

Section: Fig 8 Optimization Setup Windowmentioning

confidence: 99%