2007
DOI: 10.1007/s11664-007-0348-5
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Practical Surface Treatments and Surface Chemistry of n-Type and p-Type GaN

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Cited by 29 publications
(26 citation statements)
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“…As largely reported for the GaN(0001) surface, HCl etching decreases to low levels the areal concentration of typical surface contaminants (C and O) [Ref. [18], section 3.1] and prevents reoxidation [21]. The subsequent annealing step reduces the amount of residual Cl left after HCl etching [21,22].…”
mentioning
confidence: 62%
“…As largely reported for the GaN(0001) surface, HCl etching decreases to low levels the areal concentration of typical surface contaminants (C and O) [Ref. [18], section 3.1] and prevents reoxidation [21]. The subsequent annealing step reduces the amount of residual Cl left after HCl etching [21,22].…”
mentioning
confidence: 62%
“…Further spectroscopic characterization is performed on the n-type Ga-polar GaN samples to understand changes in the surface composition during solution exposure. More specifically, we carried out X-ray photoelectron spectroscopy (XPS) characterization with the intent of quantifying oxide formation 20 in air and in solution before and after UV exposure. The solution used in these studies is Dulbecco’s modified Eagle’s medium (DMEM), which is suitable for the growth of PC12 cells.…”
Section: Results and Discussionmentioning
confidence: 99%
“…Comparative results show that HCl is the most efficient concerning surface oxygen coverage decrease and HF for carbon reduction [11]. GaN surfaces treated with HCl are contaminated with Cl atoms which occupy dangling bonds left by some of the oxygen atoms and prevent re-oxidation process [10,12]. Given that wet etching techniques cannot completely remove the oxygen and carbon contamination, methods such as annealing under ultrahigh vacuum (UHV) or an ion bombardment need to be introduced to obtain clean surfaces.…”
Section: Introductionmentioning
confidence: 99%