2006 IEEE International Reliability Physics Symposium Proceedings 2006
DOI: 10.1109/relphy.2006.251192
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Precise and Simple Methods for Detection of Initial Defects in 1.2 nm Gate Dielectrics Based on Nonlinear Conductions

Abstract: A sensitive and simple method to detect process-induced initial defects in fresh ultra-thin gate dielectrics is proposed, where only variations of gate leakage currents are estimated at a low gate voltage. This method proves to be a powerful tool for choosing the suitable manufacturing conditions to suppress the initial defects and predicting reliabilities of MOSFETs. The measurement conditions were determined from detailed studies of characteristic behaviors of the leakage currents through the initial defects… Show more

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Cited by 2 publications
(2 citation statements)
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“…Finally, we note that a close similarity has been observed in the breakdown characteristics of certain process-induced ("extrinsic") and wear-out induced failures 74 . A simple method to detect processinduced defects has recently been described by Suto 75 .…”
Section: Macroscopic Process-induced Defectsmentioning
confidence: 99%
“…Finally, we note that a close similarity has been observed in the breakdown characteristics of certain process-induced ("extrinsic") and wear-out induced failures 74 . A simple method to detect processinduced defects has recently been described by Suto 75 .…”
Section: Macroscopic Process-induced Defectsmentioning
confidence: 99%
“…32,33) Furthermore, it is difficult to detect the extrinsic defects, if any exist, because the excessive leakage current caused by the breakdown is possibly masked by the current that flows through the intrinsic portion of the test structures. 34) All these results seem to have distracted the reliability engineers' concern from the extrinsic defects.…”
Section: Introductionmentioning
confidence: 99%