Precise drilling of steel with ultrashort pulsed solid state lasers

Foehl, Christian; Breitling, Detlef; Dausinger, Friedrich

doi:10.1117/12.515612

Cited by 27 publications

(3 citation statements)

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“…The effect of laser polarization on the outlet has been reported. It was presented that there were two bulges located around the outlet and they were placed opposite to each other and oriented perpendicular to the direction of the polarization of the laser beam, which was confirmed by turning the direction of the polarization by 90° [30,31]. The reason is related to the different reflectivity in S- and P-polarization directions on the side-wall surface.…”

Section: Resultsmentioning

confidence: 99%

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

Zhao

Wang

2018

Polymers

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High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0 ~ 2 µm could be successfully drilled in FPCs using ultrashort pulse laser.

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Section: Resultsmentioning

confidence: 99%

Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

Zhao

Wang

2018

Polymers

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“…Laser drilling ways are generally divided as punch drilling method and the contour circuitous method [9] . For punch drilling method, laser machine needs a larger average power, which is often used in ms and ns-laser machine with lower accuracy.…”

Section: Processing Methods Equipment and Materialsmentioning

confidence: 99%

A Study of Picosecond-Laser Drilling Technique in Ceramics

Hu¹,

Wang²,

Lu³

et al. 2014

AMR

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In this paper, the technique of drilling process with picosecond(ps) laser is studiedinAl2O3 ceramics. The defocus method is used to drill the ceramic slice, which is able to improve thedrilling ratio of depth to diameter.It is found out that the best location ofthis ps-laser is about0.15mm under the lower surface of workpiece,demonstrating the difference from nanosecond(ns)-laser machinein the respective ofdefocusing.The impact of the power and the processing speed isinvestigated on the quality of the drilling. For ps-laser machine,a smaller and high qualitythrough-holeis achievable by increasing the power of laser and reducing the speed of process, withthe ratio of depth to diameter from 3.12 to 4.27.The ratio can be further increased upto 6.25,throughoptimization of these three parameters: defocusing amount, laser power and laser processing speed.

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“…Also, changes in the beam delivery system have been utilized, e.g. employing lenses with different focal distances (Nasrollahi et al, 2018), varying the polarization of the beam either by mechanical rotation of half wave plate (Föhl et al, 2002) or using fast-response liquid-crystal polarization rotator (Allegre et al, 2012).…”

Section: Introductionmentioning

confidence: 99%