Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water

Aida, Hideo; Kim, Seong-Woo; Ikejiri, Kenjiro; Doi, Toshiro; Yamazaki, Tsutomu; Seshimo, Kiyoshi; Koyama, Koji; Aota, Natsuko

doi:10.1016/j.precisioneng.2014.10.008

Cited by 20 publications

(7 citation statements)

References 24 publications

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“…Different slurries have been used to polish single-crystalline cplane (0001) GaN substrates. Experimental results also proved that 0.5-MNB slurries result in relatively higher removal rates and lesser damage than 0.5-EG slurry [2].…”

Section: Nanomechanical Machiningmentioning

confidence: 68%

“…Nowadays, mechanical polishing is widely used as the final or semi-final treatment of electronical and opto-electronical materials such as Si, glass, sapphire, GaAs, GaN, and SiC [3]. Recently, water containing micro-, nano-, or micro-nanobubbles (MNB) [2] of gas has been revealed to have interesting properties that could possibly be exploited for water-based slurries used in polishing. Different slurries have been used to polish single-crystalline cplane (0001) GaN substrates.…”

Section: Nanomechanical Machiningmentioning

confidence: 99%

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Nanomanufacturing—Perspective and applications

et al. 2017

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Section: Nanomechanical Machiningmentioning

confidence: 68%

Section: Nanomechanical Machiningmentioning

confidence: 99%

Nanomanufacturing—Perspective and applications

et al. 2017

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“…Nowadays, more and more researchers have introduced auxiliary methods such as ultrasonic [3,4], plasma [5], photocatalysis [6,7], micro-bubbles [8,9], and other auxiliary methods to improve the polishing efficiency. Among them, the ultrasonic and microbubble auxiliary methods both involve micro-level and nano-level bubbles.…”

Section: Introductionmentioning

confidence: 99%

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Park

Hong

et al. 2023

Friction

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The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in detail. Based on the mixed lubrication or thin film lubrication, bubble—wafer plastic deformation, spherical indentation theory, Johnson—Cook (J—C) constitutive model, and the assumption of periodic distribution of pad asperities, a new model suitable for micro-nano bubble auxiliary material removal in CMP was developed. The model integrates many parameters, including the reactant concentration, wafer hardness, polishing pad roughness, strain hardening, strain rate, micro-jet radius, and bubble radius. The model reflects the influence of active bubbles on material removal. A new and simple chemical reaction method was used to form a controllable number of micro-nano bubbles during the polishing process to assist in polishing silicon oxide wafers. The experimental results show that micro-nano bubbles can greatly increase the material removal rate (MRR) by about 400% and result in a lower surface roughness of 0.17 nm. The experimental results are consistent with the established model. In the process of verifying the model, a better understanding of the material removal mechanism involved in micro-nano bubbles in CMP was obtained.

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“…Microbubble technologies have been the subject of intensive research over the past decade, due to their wide applications in various industries and processes, such as: flotation and separation in mineral processing industry [1], polishing slurry used in precise mechanical polishing [2], processing of leaching water [3], and wastewater treatment [4], [5]. Microbubbles (MBs) are tiny bubbles with a respective diameter of 10-50 µm [5].…”

Section: Introductionmentioning

confidence: 99%

Dynamic Analysis of Shaft System of Micro Bubble Generating Pump

Bahrudin¹,

Sugiarto²

2017

IJMMM

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Abstract-Gas-liquid mixing pump is one type of microbubble generator which is very efficient for mixing gas and liquid directly and dissolve them. However, one of the problems in designing the rotating machinery is the vibration, because the vibration is usually a direct cause of the component damage. In this paper, the dynamic characteristic of shaft system on a micro bubble generating pump was evaluated based on finite element analysis using ANSYS to investigate the stability and the critical speed of the system. Based on the results of evaluation, finite element analysis can predict the vibration modes on the entire segment of the shaft system in accordance with the natural frequencies of the respective modes. However, it did not find any critical speeds below the design rotational velocity of the shaft system. It can be concluded that the shaft system of the gas-liquid mixing pump was still outside the resonance region and the structural design of the shaft system could be operated safely.. Index Terms-Finite element, Campbell diagram, natural frequency, micro bubble, gas-liquid mixing pump.

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Precise mechanical polishing of brittle materials with free diamond abrasives dispersed in micro–nano-bubble water

Cited by 20 publications

References 24 publications

Nanomanufacturing—Perspective and applications

Nanomanufacturing—Perspective and applications

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Dynamic Analysis of Shaft System of Micro Bubble Generating Pump

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