“…Various types of precursors have been applied in the deposition of tin oxide and tin sulfide films, including SnCl 4 , Sn(OC(CH 3 ) 3 ) 4 , Sn(NO 3 ) 4 , dimethyltin dichloride ((CH 3 ) 2 SnCl 2 , DMTC), monobutyltin trichloride (n–C 4 H 9 SnCl 3 , MBTC), Me 4 Sn, Et 4 Sn, Me 2 Sn(NMe) 2 , Bu 2 Sn(O 2 CMe) 2 , Sn(O 2 CMe) 2 , and Sn(NMe 2 ) 2 , Sn(acac) 2 (acac=acetylacetonate), Sn n Bu 2 (CH 3 COO) 2 , Sn(tbba) (tbba= N 2 , N 3 ‐di‐tert‐butyl‐butan‐2,3‐diamine), and more. It is well known that when depositing precursors including various types of tin based materials, methods such as solution based CVD and aerosol‐assisted (AA)CVD along with atomic layer deposition (ALD) are arising to overcome the barriors such as having a low vapor pressure of decomposition of the ligands used in precursor during deposition ,…”