Predicting Microwave Digital Signal Integrity

Buckwalter, James F.

doi:10.1109/tadvp.2008.2011560

Cited by 49 publications

(22 citation statements)

References 19 publications

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“…Due to the interconnect lines unmatching, several electromagnetic (EM) and electrical phenomena need to be predicted during the characterization of high speed signals as electrical fast transient (EFT) and surge voltages/currents behaviors. Owing to such an effect, various numerical and analytical modelling methods of interconnect lines for high speed signal sharing were developed [3][4][5][6]. Those easy and fast computational methods are subsequently integrated by electronic design engineers in their circuit models in order to predict the signal integrity (SI) especially when the operating frequency is higher [2][3][4][5][6].…”

Section: Introductionmentioning

confidence: 99%

Analysis of Excitation Pulsed Signal Propagation for Atom Probe Tomography System

Ravelo¹,

Vurpillot²

2014

PIER Letters

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Abstract-The purpose of this paper is on the behavioral modelling of surge voltage pulses used in Atom Probe Tomography. After brief description of the atom probe functioning principle, we examine the excitation electrical pulse signal integrity along the electric pulser (E-pulser) feeding line modelling with respect to the IEC1733/04 standard. This feeding electric line is ended by cylindrical via ground to control the ion emission. By using the transmission line (TL) ultra-broadband RLCG model, the propagating pulsed signals degradation is predicted. The signal propagation was analysed in both frequency and time domains by taking into account the substrate dispersion. The wideband frequency behaviours of the surge signal along the feeding line were examined from DC-to-2 GHz. In addition, by considering pulse surge signals with pulse-width and rise-/fall-time parameters (T 1 = 9 ns, t r1 = t f 1 = 1.6 ns) and (T 2 = 30 ns, t r2 = 4 ns/t f 2 = 18 ns), the transient responses from 5 cm-to-20 cm length TL are characterized. It was shown that the excitation pulse was significantly distorted. It was emphasized that the operated signal delay varies from 0.3 ns-to-1.5 ns in function of the via capacitor value. The time-dependent radiated E-field on the performance of the atom probe system which enables to characterize the nature of tested materials (ions or atoms) is discussed. The presented analysis approach is particularly useful for E-pulser integrated in measurement scientific instruments as Atom Probe Tomography time of flight optimisation, a nano-analysing technique that uses ultra-sharp high vacuum pulse to induce controlled erosion of samples. In this application, the excitation voltage pulse integrity during the propagation is required in order to improve the measurement instrument performances.

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Section: Introductionmentioning

confidence: 99%

Analysis of Excitation Pulsed Signal Propagation for Atom Probe Tomography System

Ravelo¹,

Vurpillot²

2014

PIER Letters

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“…The combination of the functional diversification ("More than Moore") and the integration technologies ("More Moore") lead to new EMC challenges in order to make coexisting these micro-systems in restricted environments [1][2]. This arrangement of technologies is the worthwhile and strategic work to target in order to obtain a high value system [2][3][4]. In addition to this constant increase in density, since the digital systems reach very high data rates, the fidelity of these RF-digital signals must be taken into account by designers [3][4][5][6], [11].…”

Section: Introductionmentioning

confidence: 99%

“…This arrangement of technologies is the worthwhile and strategic work to target in order to obtain a high value system [2][3][4]. In addition to this constant increase in density, since the digital systems reach very high data rates, the fidelity of these RF-digital signals must be taken into account by designers [3][4][5][6], [11]. In order to preserve the acceptable functioning of modern high speed digital electronics, since the early 1990s, critical requirements on the signal integrity (SI) were established [3], [5][6].…”

Section: Introductionmentioning

confidence: 99%

Assessment of 50%-Propagation-Delay for Cascaded PCB Non-Linear Interconnect Lines for the High-Rate Signal Integrity Analysis

Eudes

Ravelo

Al-Hayek³

2013

AEM

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This paper is a special issue from the work presented in the Advanced Electromagnetics Symposium 2012 (AES'12) which presents an enlarged study about the 50-% propagation-time assessment of cascaded transmission lines (TLs). First and foremost, the accurate modeling and measurement technique of signal integrity (SI) for high-rate microelectronic interconnection is recalled. This model is based on the reduced transfer function extracted from the electromagnetic (EM) behavior of the interconnect line RLCG-parameters. So, the transfer function established takes into account both the frequency dispersion effects and the different propagation modes. In addition, the transfer function includes also the load and source impedance effects. Then, the SI analysis is proposed for high-speed digital signals through the developed model. To validate the model understudy, a prototype of microstrip interconnection with w = 500 µm and length d = 33 mm was designed, simulated, fabricated and tested. Then, comparisons between the frequency and time domain results from the model and from measurements are performed. As expected, good agreement between the S-parameters form measurements and the model proposed is obtained from DC to 8 GHz. Furthermore, a de-embedding method enabling to cancel out the connectors and the probe effects are also presented. In addition, an innovative time-domain characterization is proposed in order to validate the concept with a 2.38 Gbit/sinput data signal. Afterwards, the 50-% propagation-time assessment problem is clearly exposed. Consequently an extracting theory of this propagation-time with first order RC-circuits is presented. Finally, to show the relevance of this calculation, propagation-time simulations and an application to signal integrity issues are offered.

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“…To meet this spectacular progress, high performance reconfigurable processors and ultra-high speed wired and wireless communicating systems operating up to tens of GHz were deployed [2][3][4][5][6][7][8][9]. Due to the unceasing increase of the electronic system integration, the modern high-speed electronic equipment meets different technological roadblocks due to the interconnect complexity [10][11][12][13][14][15]. In addition to the investigation on the apparition of electromagnetic interferences (EMI) and electromagnetic compatibility (EMC), many works stating the power loss and the interconnect delay effects for example, in the RF/digital devices were done [6,[16][17][18][19][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

“…During the data stream transmission, these technological issues can be sources of signal distortions, asynchronous effects of the transmitted analog signals and erroneous symbols. So, intensive researches were performed on the modeling of the interconnect networks in order to predict the signal integrity (SI) [9,[11][12][13][14][15][17][18][19][20][21][22][23][24]. To minimize the cost and energy consumption and also for sharing data and clock signals through multipath circuits can be composed of ICs packaged in different levels this later is fundamental [25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

Behavioral Model of Symmetrical Multi-Level T-Tree Interconnects

Ravelo¹

2012

PIER B

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Abstract-An accurate and behavioral modeling method of symmetrical T-tree interconnect network is successfully investigated in this paper. The T-tree network topology understudy is consisted of elementary lumped L-cells formed by series impedance and parallel admittance. It is demonstrated how the input-output signal paths of this single input multiple output (SIMO) tree network can be reduced to single input single output (SISO) network composed of L-cells in cascade. The literal expressions of the currents, the input impedances and the voltage transfer function of the T-tree electrical interconnect via elementary transfer matrix products are determined. Thus, the exact expression of the multi-level behavioral T-tree transfer function is established. The routine algorithm developed was implemented in Matlab programs. As application of the developed modeling method, the analysis of T-tree topology comprised of different and identical RLC-cells is conducted. To demonstrate the relevance of the model established, lumped RLC T-tree networks with different levels for the microelectronic interconnect application are designed and simulated. The work flow illustrating the guideline for the application of the routine algorithm summarizing the modeling method is proposed. Then, 3D-microstrip T-tree interconnects with width 0.1 µm and length 3 mm printed on FR4-substrate were considered. As results, a very good agreement between the results from the reduced behavioral model proposed and SPICE-computations is found both in frequency-and timedomains by considering arbitrary binary sequence "01001100" with 2 Gsym/s rate. The model proposed in this paper presents significant benefits in terms of flexibility and very less computation times. It can be used during the design process of the PCB and the microelectronic circuits for the signal integrity prediction. In the continuation of this 24Ravelo work, the modeling of clock T-tree interconnects for packaging systems composed of distributed elements using an analogue process is in progress.

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Predicting Microwave Digital Signal Integrity

Cited by 49 publications

References 19 publications

Analysis of Excitation Pulsed Signal Propagation for Atom Probe Tomography System

Analysis of Excitation Pulsed Signal Propagation for Atom Probe Tomography System

Assessment of 50%-Propagation-Delay for Cascaded PCB Non-Linear Interconnect Lines for the High-Rate Signal Integrity Analysis

Behavioral Model of Symmetrical Multi-Level T-Tree Interconnects

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