Predicting solder joint shape by computer modeling

Freedman, G.M.; Racz, Livia; Szekely, J.

doi:10.1109/ectc.1994.367497

Cited by 8 publications

(6 citation statements)

References 10 publications

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“…SE is powerful finiteelement software dedicated to the computation of energyminimizing surfaces defined by geometrical and physical constraints [52]. Its mathematical solver works essentially in 2D, i.e.…”

Section: Finite-element Modelmentioning

confidence: 99%

Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study

Mastrangeli

Valsamis

Hoof

et al. 2010

J. Micromech. Microeng.

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Capillarity is pivotal to many important technologies, including capillary self-alignment and self-assembly for heterogeneous microsystem integration and packaging. Lateral capillary forces ensuing from perturbed fluid menisci were the object of substantial theoretical and numerical modeling in recent years. Anyway, those studies were so far unsatisfactorily supported by direct experimental inspections. In this paper we present a comprehensive quasi-static study of lateral capillary forces arising from a constrained cylindrical fluid meniscus subjected to small lateral perturbations. We describe the novel experimental apparatus that we designed to accurately characterize such a fundamental system. We then reproduce our experimental data on lateral meniscus forces and stiffnesses by means of both a finite element and a novel analytical model. The agreement between our measurements and models, while confirming earlier reports, provides a solid foundation for the applications of lateral capillary forces to microsystem assembly. Moreover, our experimental apparatus may enable the exploitation of Gibbs' inequality to measure the advancing contact angles of liquids, and it may be used as a reference testbed for further experimental investigations on constrained fluid menisci.

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Section: Finite-element Modelmentioning

confidence: 99%

Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study

Mastrangeli

Valsamis

Hoof

et al. 2010

J. Micromech. Microeng.

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“…The SE offers the possibility to study the shape of surfaces under the influence of quantities such as surface tension and gravity. Applications include simulations of the water−air interface, but also include investigations of other problems such as, for example, the geometry of solder joints . In the SE, an initial surface is specified by the user: this includes the definition of the simulation geometry, the specification of the respective interfacial energies, and the setting of boundary conditions.…”

Section: Simulationmentioning

confidence: 99%

“…Applications include simulations of the water-air interface, but also include investigations of other problems such as, for example, the geometry of solder joints. 34 In the SE, an initial surface is specified by the user: this includes the definition of the simulation geometry, the specification of the respective interfacial energies, and the setting of boundary conditions. The surface is discretized and approximated by a mesh of triangular facets.…”

Section: Simulationmentioning

confidence: 99%

Contact Line Shape on Ultrahydrophobic Post Surfaces

Dorrer

Rühe

2007

Langmuir

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In this work, we investigate the configuration of the contact line of a water drop lying on an ultrahydrophobic post surface using the numerical algorithm Surface Evolver. For the special situation of Cassie wetting, we propose a modified definition of the contact line as the line in space where the meniscus starts to curve upward out of the plane of the composite surface. In our simulations, it is found that the contact line is very strongly distorted, indicating a strong tendency of the drop to "ball up" in those areas where it is not in contact with the solid surface. The distortion of the contact line corresponds to a pronounced deformation of the liquid-air interface around the base of the drop. We discuss the consequences of this distortion for the definition and practical measurement of the contact angle on ultrahydrophobic surfaces.

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“…Since the finite element analysis technique is used in this method, SE is capable of predicting very complex solder joint shape that is otherwise impossible with other methods mentioned above. The validity of this tool has been verified on both surface mount devices [1] and BGA components by comparing predicted and measured geometry of solder joint shape. More details on various solder joint prediction methods can be found in the literature [12].…”

mentioning

confidence: 98%

“…Numerous researches [1]- [7] have been implemented to study how the solder joint geometry could be affected by design and processes at different fabrication and assembly stages, and also how the solder joint geometry like the shape and height affects the integrity of the interconnects under thermal cycling.…”

mentioning

confidence: 99%

Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling

Liao

Tay

Ang

et al. 2006

IEEE Trans. Comp. Packag. Technol.

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This paper addresses fatigue and bridging issues by numerical analysis for an ultra-fine-pitch flip-chip interconnect that consists of multiple copper columns (MCC) and a solder joint. First, the processing flow is briefly presented, which enables prototyping of high-aspect-ratio ( 6) copper columns, and hence, enhanced thermomechanical reliability of the interconnects. A public software, Surface Evolver (SE), has been used through this work to predict the solder joint geometry evolution. By integrating SE solder joint shape modeling, stress/strain analysis within ANSYS, and design of experiment (DoE) techniques as well, detailed numerical analysis has been conducted on the solder joint fatigue response to various factors such as the Cu-Solder wetting angle, loading direction, and solder geometry parameters. Finally, by applying the DoE techniques and the most updated features of SE, bridging risks of this interconnect with a fine pitch of 40 m is investigated, in which critical solder volume is calculated as a function of the interconnect geometry parameters. Based on these results, a solid basis for the design and processing of this advanced flip-chip interconnect has been established.Index Terms-Fatigue, flip-chip, multicopper-column (MCC) interconnect, solder bridging, solder joint shape, wafer-level packaging.

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Predicting solder joint shape by computer modeling

Cited by 8 publications

References 10 publications

Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study

Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study

Contact Line Shape on Ultrahydrophobic Post Surfaces

Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling

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