2016
DOI: 10.1007/s00107-016-1056-8
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Predicting the strength reduction of particleboard subjected to various climatic conditions in Japan using artificial neural networks

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Cited by 5 publications
(1 citation statement)
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“…There are a few studies related to the wood-based panel properties based on ANNs such as modeling formaldehyde emission (Akyuz et al, 2017), predicting effect of adding paraffi n on physical properties of medium density fi berboard (Gurgen et al, 2019), predicting the internal bond strength of the particleboard under outdoor exposure (Watanabe et al, 2015;Korai and Watanabe, 2016), optimizing the process parameters in wood-based panel production (Cook et al, 2000;Ozsahin, 2013), obtaining the values of the internal bond of the particleboard using the manufacturing parameters (Cook and Chiu, 1997), predicting the particleboard mechanical properties (Fernandez et al, 2008), so on.…”
Section: Introduction 1 Uvodmentioning
confidence: 99%
“…There are a few studies related to the wood-based panel properties based on ANNs such as modeling formaldehyde emission (Akyuz et al, 2017), predicting effect of adding paraffi n on physical properties of medium density fi berboard (Gurgen et al, 2019), predicting the internal bond strength of the particleboard under outdoor exposure (Watanabe et al, 2015;Korai and Watanabe, 2016), optimizing the process parameters in wood-based panel production (Cook et al, 2000;Ozsahin, 2013), obtaining the values of the internal bond of the particleboard using the manufacturing parameters (Cook and Chiu, 1997), predicting the particleboard mechanical properties (Fernandez et al, 2008), so on.…”
Section: Introduction 1 Uvodmentioning
confidence: 99%