Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating

Wei, Hu; Tan, Tong; Liu, Renlong; Guo, Lanfeng; Tao, Changyuan; Qin, Xiang

doi:10.1021/acsomega.3c05248

Cited by 2 publications

(2 citation statements)

References 27 publications

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“…It is important to note that inhibitors can only exhibit effective inhibitory effects when Cl – is present in the electroplating solution. In the presence of chloride ions in the solution, PEG strongly inhibits the deposition of metallic copper, usually causing an increase of several hundred millivolts in the deposition overpotential of Cu …”

Section: Electroplating Additivesmentioning

confidence: 99%

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Electroplated Copper Additives for Advanced Packaging: A Review

Guo,

Li,

et al. 2024

ACS Omega

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Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this minireview also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.

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Section: Electroplating Additivesmentioning

confidence: 99%

“…In the presence of chloride ions in the solution, PEG strongly inhibits the deposition of metallic copper, usually causing an increase of several hundred millivolts in the deposition overpotential of Cu. 27 …”

Section: Electroplating Additivesmentioning

confidence: 99%