Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies

Chin, Melida; Iyer, Kaushik A.; Hu, S. Jack

doi:10.1109/tcapt.2004.828565

Cited by 57 publications

(36 citation statements)

References 13 publications

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“…1 However, none of the previous work has compared the results with the measurements on individual particles, and all predict much lower resistance values than those measured in bulk conductive adhesives. 17 Analyzing the resistance of individual MPS under compression can yield a fundamental understanding that will facilitate the tailoring of particles and the bonding process for electronics assembly.…”

Section: A)mentioning

confidence: 99%

Electromechanical characterization of individual micron-sized metal coated polymer particles

Bazilchuk

Pettersen

et al. 2016

Journal of Applied Physics

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Micron-sized polymer particles with nanoscale metal coatings are essential in conductive adhesives for electronics assembly. The particles function in a compressed state in the adhesives. The link between mechanical properties and electrical conductivity is thus of the utmost importance in the formation of good electrical contact. A custom flat punch set-up based on nanoindentation has been developed to simultaneously deform and electrically probe individual particles. The set-up has a sufficiently low internal resistance to allow the measurement of sub-Ohm contact resistances. Additionally, the set-up can capture mechanical failure of the particles. Combining this data yields a fundamental understanding of contact behavior. We demonstrate that this method can clearly distinguish between particles of different sizes, with different thicknesses of metal coating, and different metallization schemes. The technique provides good repeatability and physical insight into the behavior of these particles that can guide adhesive design and the optimization of bonding processes.

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Section: A)mentioning

confidence: 99%

Electromechanical characterization of individual micron-sized metal coated polymer particles

Bazilchuk

Pettersen

et al. 2016

Journal of Applied Physics

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“…In order to solve these issues, the electrical conduction mechanism of ACA joints must be understood completely. It is known that the total electrical resistance of an ACA joint contains the contact resistance on contact surfaces (constriction resistance and tunneling resistance) and the bulk resistance of conductive particles, as shown in Fig.1 [2]. Herein, the constriction resistance is induced by the roughness of contact surfaces between particles and metal pads and the tunneling resistance is caused by the ultra-thin insulating films on the contact surfaces [2].…”

Section: Introductionmentioning

confidence: 99%

“…However, most of the previous studies evaluated the constriction resistance assuming that the contact surfaces between particles and metal pads are perfectly smooth. Instead of individual micro spots, just an ideal circle spot is used to calculate the constriction resistance by Holm's law [2], but this is not a truth in the practical bonding. Constable has observed that the real contact area is much smaller than the apparent area due to the asperities on rough surfaces, as shown in Fig.2 [9].…”

Section: Introductionmentioning

confidence: 99%

Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface

Chen

Tao

Yin

2011

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

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In anisotropic conductive adhesive (ACA) bonding, the components' surfaces are not completely smooth and there are a great number of individual micro spots on the contact surfaces between particles and metal pads. However, most of the previous studies about contact resistance of ACA joints have neglected the roughness of contact surfaces between particles and metal pads and thus it may underestimate the contact resistance. This paper presents a model to analyze the effects of the roughness on the contact resistance of an ACA joint with Au coated polymer particles. The rough surface is constructed with micro cylinders and the roughness is represented with asperity density, asperity height and asperity radius. The model finds that the contact resistance increases obviously with the decrement of asperity density and asperity radius, while it is not sensitive to asperity height. In addition, the bulk resistance of asperities should be considered if the asperity radius is too small, and it even may playa major role

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“…The complexity results from the complex mechanical and electrical interactions between the polymer matrix, filler and bumps. Extensive analysis of the mechanics of ACF interconnection and assembly has been published [5][6][7][8]. However, researchers have been unable to develop a model that accurately predicts the conduction mechanism in ACF interconnects.…”

Section: Introductionmentioning

confidence: 99%

Kinetically controlled assembly of terpheny-4,4”-dithiol self-assembled monolayers (SAMs) for highly conductive anisotropically conductive adhesives (ACA)

Agar

Durden

Zhang

et al. 2011

2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

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Anisotropically conductive adhesives (ACA) are a promising alternative to solder interconnects for high performance electronic devices due to their increased I/O capabilities and reduced form factor. Previous studies have shown that modification of Au coated Ni/Cu bumps with conjugated self-assembly monolayers (SAMs) increases conductivity, current carrying capacity and reliability of ACA interconnects [1][2][3]. In this study, we kinetically control the assembly of p-Terphenyl-4,4"-dithiol (TPD) monolayers on Au bumps. Using a custom designed test vehicle we show how TPD SAMs can either increase or decrease the single bump resistance depending on the kinetics of the monolayer formation and its resulting structure. Future studies focusing on controlling monolayer assembly will determine the efficacy of conjugated SAMs at enhancing the conductivity and current carrying capacity of ACA interconnects.

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Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies

Cited by 57 publications

References 13 publications

Electromechanical characterization of individual micron-sized metal coated polymer particles

Electromechanical characterization of individual micron-sized metal coated polymer particles

Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface

Kinetically controlled assembly of terpheny-4,4”-dithiol self-assembled monolayers (SAMs) for highly conductive anisotropically conductive adhesives (ACA)

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Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesive Assemblies

Cited by 57 publications

References 13 publications

Electromechanical characterization of individual micron-sized metal coated polymer particles

Electromechanical characterization of individual micron-sized metal coated polymer particles

Simulation for the contact resistance of a single anisotropic conductive adhesive particle with rough surface

Kinetically controlled assembly of terpheny-4,4&#x201D;-dithiol self-assembled monolayers (SAMs) for highly conductive anisotropically conductive adhesives (ACA)

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Product

Resources

About

Kinetically controlled assembly of terpheny-4,4”-dithiol self-assembled monolayers (SAMs) for highly conductive anisotropically conductive adhesives (ACA)