Prediction of stand-off height and 3D shape of solder joint in fiber attachment soldering

Abstract

The three-dimensional (3-D) shape of solder joint in fiber attachment soldering was predicted by employing Finite Element Method (FEM). Based on the minimum potential energy theorem and data from shape simulation, the influence of material and manufactuiing parameters on the Stand-Off Height (SOH) between optical fiber and substrate was analyzed in detail. The results showed that the z-axis alignment of optical fiber can be controlled by solder volume and solder joint design.