2020
DOI: 10.14569/ijacsa.2020.0111225
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Predictive System of Semiconductor Failures based on Machine Learning Approach

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Cited by 8 publications
(4 citation statements)
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“…Recent prediction methods consider long-range dependencies and heavy tail characteristics in the assessment of RUL [14]. The methods for classification tasks include Hierarchical Clustering (HC) [15], Support Vector Machine (SVM) [16,17], Decision Tree (DT) [18], and Random Forest (RF) [19]. In the field of deep learning, methods such as Convolutional Neural Network (CNN) combined with LSTM have been employed [20].…”
Section: A Backgroundmentioning
confidence: 99%
“…Recent prediction methods consider long-range dependencies and heavy tail characteristics in the assessment of RUL [14]. The methods for classification tasks include Hierarchical Clustering (HC) [15], Support Vector Machine (SVM) [16,17], Decision Tree (DT) [18], and Random Forest (RF) [19]. In the field of deep learning, methods such as Convolutional Neural Network (CNN) combined with LSTM have been employed [20].…”
Section: A Backgroundmentioning
confidence: 99%
“…The high complexity of the semiconductor production system is not compatible with a unified framework able to face all related PdM problems. However, some categorizations are attempted in the literature aimed at defining groups of homogeneous frameworks from the system point of view [ 18 , 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 ].…”
Section: Introductionmentioning
confidence: 99%
“…In practice, each application of the semiconductor industry together with its endowed methodology for PdM can be considered as a case study. PdM has been applied, e.g., to transport of wafers [ 43 , 44 ], prediction of wafer failures [ 27 , 37 , 45 , 46 , 47 , 48 ], ion-beam etching [ 49 , 50 ], supply chain [ 51 ], vibration during normal operation [ 44 ], and pump and abatement equipment [ 35 ].…”
Section: Introductionmentioning
confidence: 99%
“…These techniques, which extract key features from data and correlate them to possible faults [3] are successfully applied in condition monitoring of e.g. gearbox [4][5][6], rotating machinery [7], motor bearings [8], centrifugal pumps [9,10], hydraulic systems [11], cutting tools [12], grinding mill liners [13], and semiconductor failures [14].…”
Section: Introductionmentioning
confidence: 99%