Preparation and Characterization of Copper Nanocomposite Textiles

Abstract

Fibrous textiles have been increasingly used in a variety of industries. In these applications, the surface properties of textile materials play a very important role. The surface properties of textile materials can be modified by various techniques. Copper (Cu) nanocomposite textiles are prepared by magnetron sputter coating. The nanocomposite textiles with different thickness of coatings are investigated by atomic force microscope (AFM), energy-dispersive X-ray analysis, and opto-electrical tests. The AFM observations reveal the growth of the Cu nanostructures formed on the fiber surface as the sputtering time increases. The surface conductivity of the textiles coated with Cu nanostructures shows a significant increase compared to the uncoated ones. The increased coating thickness leads to better electrical conductivity. The coated textiles also show considerable improvement in UV and visible light shielding, examined by UV/Vis spectrometer.

AFM Analysis of Fullerene C60 Coated Para-Aramid Fabric via Physical Vapor Deposition

“…In the present study, the decrease observed in the tensile properties for the C60 coated fabric samples might be caused by the coarser particles accumulating on the fabric surface as the thickness increased. Coating of textiles with physical vapor deposition (PVD) methods compared to conventional methods has advantages of being environmentally friendly as it is a solvent-free application, uniform deposition of the coating, coating at low temperatures for polymeric fibers and shorter production periods [14][15][16][17].…”

Conductive coatings for textiles

“…Textile metallisation technologies, which include vacuum deposition, ion plating, electroplating and electroless plating, deposit metallic particles on the textile surface and create metallic-coated textiles (Dietzel et al 2000(Dietzel et al , 2008Akbarov et al 2005Akbarov et al , 2006Lee et al 2005;Gasana et al 2006;Jiang et al 2006Jiang et al , 2007Jiang and Guo 2008;Wei et al 2008). Coating precious metals on textile surfaces have had a long history for aesthetic or protective purposes.…”

“…Wei et al (2008) reported that copper sputter coating on the surfaces of polypropylene (PP) nonwovens reduced the surface electrical resistance signifi cantly, and the resistance decreased as the coating thickness increased. Their electrical conductivity can be tailored by controlling the coating thickness and choosing the right metals.…”

“…To make fl exible substrates conduct electricity, many methods have been developed (Gregory et al 1991;Dietzel et al 2000Dietzel et al , 2008Akbarov et al 2005Akbarov et al , 2006Carpi and De Rossi 2005;Wang et al 2005;Kaynak et al 2006;Gan et al 2008;Roh et al 2008;Sen 2008;Wei et al 2008). The electronic textiles should be fl exible, lightweight, comfortable, economical and durable, and more importantly they require electroconductive materials, such as conductive yarns and fabrics.…”

In situ DEPOSITION OF COPPER NANOPARTICLES ON POLYETHYLENE TEREPHTHALATE FILTERS AND ANTIBACTERIAL TESTING AGAINST Escherichia coli AND Salmonella enterica

“…Besides the choice of polymeric material for CuNP incorporation, the synthetic method is another important aspect to consider. Many studies have reported incorporation of inorganic nanomaterials into polymers by complicated or cost-ineffective methods for antibacterial surfaces, such as coating CuNP onto polypropylene (PP) by magnetron sputter (Wei et al, 2008), attaching TiO 2 nanoparticles to fabrics by grafting with polycarboxylic acids (Meilert et al, 2005), melt-mixing silver-based nanocomposites and polymer powder (Dastjerdi et al, 2008), argon plasma grafting SiO 2 nanoparticles on wool surface (Wang et al, 2007), reducing metallic salts inside the polymeric matrix by UV irradiation (Won et al, 2004) and silver chemical plating on polyester and cotton blended fabric (Jiang et al, 2007). CuNP were embedded onto PET fabrics by a complicated three-step process: padding the fabric with chilled NaBH 4 solution, subsequent padding with metal precursor solution and curing at 180 o C for 60 seconds (Chattopadhyay and Patel, 2014).…”