Preparation and characterization of high temperature resistant thermosetting polyphenylene ether resin

Abstract

To explore high thermal properties, low dielectric constant and loss for copper clad laminates, poly(phenylene oxide) (PPE) with different end groups (allyl and epoxide groups) were successfully prepared. Firstly, low molecular weight polyphenylene ether was synthesized using the redistribution method. Then the polyphenylene ether thermosetting polymers by modifying their terminal hydroxyl groups were reported and their fundamental materials properties were compared. Through property tests and data analyses, it was found that PPE with vinyl end groups had the best performances, especially high glass transition temperature (about 230°C), the thermal conductivity was 0.32–0.38 Wm−1 K−1, low dielectric constant (about 2.5) and low dielectric loss (about 4.4 × 10−3). The possible reason was that the main chain of polyphenylene ether contains non‐polar crosslinkable group (CC). In a word, through properties comparison of thermosets of PPE, the results demonstrated that the materials of all systems were suitable for using as printed circuit boards.

A mini‐review of ultra‐low dielectric constant intrinsic epoxy resins: Mechanism, preparation and application

“…The corresponding ε and tan δ values were 2.75 and 0.0015 at 3 GHz, respectively. Beijing Runbo Hengtong Technology Co. Ltd and Yangzhou Kolei Insulation Materials Co. Ltd have successfully developed a series of fluorinated ultra‐low ε epoxy resins 86 . These novel materials have found extensive application within the fields of highly integrated circuits and high‐frequency PCB.…”

“…The corresponding ε and tanδ values were 2.75 and 0.0015 at 3 GHz, respectively. Beijing Runbo Hengtong Technology Co. Ltd and Yangzhou Kolei Insulation Materials Co. Ltd have successfully developed a series of fluorinated ultra-low ε epoxy resins 86. These novel materials have found extensive application within the fields of highly integrated circuits and highfrequency PCB.Benefiting from the continuous transfer of PCB industry capacity to China, coupled with the strong demand growth in telecommunications, consumer electronics, computers, automotive electronics, industrial control, medical devices, national defense, and aerospace, PCB industry in China has shown the significant growth in recent years.High-layer boards, flexible boards, high-density interconnect boards and packaging substrates have become the focus and direction of the current market.6 | CONCLUSION AND OUTLOOKThe factors affecting the dielectric properties of epoxy-cured resins, and the common methods to reduce the ε of epoxy-cured resins are reviewed in this article.…”

Exploring the Cross-Linking Effect on Decreasing the Dielectric Constant and Dissipation Factor of Poly(ester imide)s at a High Frequency of 10–40 GHz

“…Polymeric materials developed in recent years are often used for low-dielectric (low-k) materials to replace traditional epoxy and phenolic resin substrates in printed circuit boards (PCB). , Because the D k is mostly greater than 3.5, epoxy and phenolic resins do not meet the standards for high-frequency transmission applications. In contrast, low-k polymers such as poly­(phenylene ether) (PPE), − polyethylene terephthalate (PET), , liquid crystal polymers (LCP), − polyimide (PI), − etc. are extensively developed.…”

Reducing the dielectric loss of poly(aryl ether)s by grafting

“…2,3 Especially in communication, polymers are being actively explored as circuit substrates, package substrates, and flexible copper-clad laminates. 4,5 At present, the communication frequency is only 2.6 GHz, but the millimeter wave used in the 5th Generation Communication Technology (5G) has a frequency as high as 30 GHz to ensure the advantages of 5G, such as high speed, low delay, and wide connection. With the popularization of the 5G, the dielectric performance requirements of polymeric materials are higher, 6 that is, the dielectric constant and dielectric loss.…”

“…Since the development of integrated circuits 60 years, 1 polymers have been widely used owing to their advantages such as low price, convenient fabrication process, low density, and high specific strength 2,3 . Especially in communication, polymers are being actively explored as circuit substrates, package substrates, and flexible copper‐clad laminates 4,5 . At present, the communication frequency is only 2.6 GHz, but the millimeter wave used in the 5th Generation Communication Technology (5G) has a frequency as high as 30 GHz to ensure the advantages of 5G, such as high speed, low delay, and wide connection.…”