Multilayer ceramic capacitor (MLCC) is a basic passive component that is widely used in electric and electronic devices. [1-4] It is fabricated by sintering the alternately stacked dielectric and electrode layer at a high temperature. [5-7] With the miniaturization of modern electronic devices, it is too expensive to prepare Pd/Ag nanopowders for the electrode. Currently, most of the normally used Pd/Ag electrode has been replaced by base-metal electrode (BME) in consumer electronics, such as Ni nanopowders. [8,9] In BME MLCCs, the laminated ceramic/ electrode layers are first heated to 300-600 C in nitrogen or air atmosphere to consume the binder, then fired at 1200-1360 C at a reducing atmosphere to protect the Ni layer from oxidation. [10] However, the Ni nanopowders have a high surface activity, which are easily oxidized at the binder removal process. Moreover, BT begins to shrink at 1100-1200 C, whereas the Ni layer begins to sinter at only 400 C. The shrinkage mismatch between Ni and ceramic layer results in severe delamination and crack in the component. These issues should be addressed to prepare highperformance BME MLCCs.