2022
DOI: 10.1016/j.ceramint.2022.01.066
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Preparation and characterization of lightweight SiC frameworks by connecting SiC fibers with SiC joints

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Cited by 7 publications
(3 citation statements)
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“…3C-SiC has good natural sphericity and self-sharpening, excellent creep resistance and fracture resistance, good sintering activity, large gap width and other excellent properties, and is widely used in aerospace precision fields such as high temperature, high pressure and high magnetic field [1][2][3] . Its high hardness and brittleness make it very easy for 3C-SiC to have cracks, point and line defects and other major forms of processing damage in the process of processing [4][5][6] , which reduces the stability of 3C-SiC materials in the process of use and greatly limits the development and application of 3C-SiC in the high-precision field.…”
Section: Introductionmentioning
confidence: 99%
“…3C-SiC has good natural sphericity and self-sharpening, excellent creep resistance and fracture resistance, good sintering activity, large gap width and other excellent properties, and is widely used in aerospace precision fields such as high temperature, high pressure and high magnetic field [1][2][3] . Its high hardness and brittleness make it very easy for 3C-SiC to have cracks, point and line defects and other major forms of processing damage in the process of processing [4][5][6] , which reduces the stability of 3C-SiC materials in the process of use and greatly limits the development and application of 3C-SiC in the high-precision field.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, the chemical vapor infiltration (CVI) technique was applied to weld the interfaces of SiC fiber (SiCF) mats by in situ generating a CVI-SiC solder at a relatively low temperature far below SiC's sintering temperature, which greatly strengthened the interfacial bonding of adjacent SiCFs. 37 This technique makes CVI-SiC an easily obtained solder for reducing the ITR of filler−filler interfaces. From the aforementioned experimental results, the highly thermally conductive solders have been proved to be able to greatly reduce the ITR between adjacent fillers and improve composites' TC.…”
mentioning
confidence: 99%
“…A better way to weld fillers is still needed. Recently, the chemical vapor infiltration (CVI) technique was applied to weld the interfaces of SiC fiber (SiCF) mats by in situ generating a CVI-SiC solder at a relatively low temperature far below SiC’s sintering temperature, which greatly strengthened the interfacial bonding of adjacent SiCFs . This technique makes CVI-SiC an easily obtained solder for reducing the ITR of filler–filler interfaces.…”
mentioning
confidence: 99%