Preparation and characterization of negative photosensitive polysiloxaneimide

Abstract

SYNOPSISA photosensitive polysiloxaneimide precursor was synthesized from oxydianiline, bis(paminophenoxy)dimethylsilane, and a diacid chloride. This diacid chloride was prepared by the reaction of thionyl chloride with a diacid, which resulted from the reaction of pyromellitic dianhydride with hydroxyethylacrylate in N-methylpyrrolidone (NMP). The adhesion properties between polyimide and substrates such as SiOe wafer were improved with introduction of siloxane moiety into the polyimide chain. The dielectric constant decreased with increasing siloxane moiety content. The photocrosslinking reaction results show that an 88-90% gel fraction was reached under the irradiation of a high-pressure mercury lamp.

Comparative study of silicon‐containing polyimides from different oxydianilines

“…With the increasing use of polyimides for gas‐separation and microelectronic applications, permeability of polyimides and adhesive ability between substrates and polyimides have become of increasing importance. Introduction of a bulky central moiety, such as dimethylsilylene, into the backbone of a polyimide can promote significant increases in permeability, permselectivity, and adhesive ability 5–11. More recently, silicon‐containing aromatic polymers have attracted much scientific technological interest because of their potential applications for the production of optoelectronic materials, resulting from the ability of silicon, when placed among aromatic neighbors, to give a σ–π conjugation and thus support the transport of electrons along the macromolecular chain 12, 13…”

Modification of negative auto-photosensitive polyimide

“…There is also a great interest in fully imidized soluble negative auto-photosensitive polyimides because of their unique properties, such as: less shrinking, good thermal and mechanical stability, good image resolution, and a simple photolithographic process. [2][3][4] With the development of electronic technology, however, the disadvantages of the photoresist, of which PSPI is the main component, become more and more obvious. The moisture absorption of the photoresist poorly influences the electric property.…”

Synthesis and characterization of polyamideimide-branched siloxane and its gas-separation

“…Additionally, an incorporation of the siloxane unit to polyimides and related polymers [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] makes it possible to increase the solubility and processibility and, furthermore, to impart impact resistance, biocompatibility, low moisture uptake, low dielectric constant, thermooxidative resistance, low surface energy, and good adhesion properties to the substrate. In our laboratory, 11 the thermal kinetics of poly(imide siloxane)s prepared from aromatic dianhydrides [4,4Ј-(hexafluoroisopropyllidene)diphtalic anhydride (6FDA), 3,3Ј,4,4Ј-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA)] and aminopropyl-terminated oligomeric dimethylsiloxane (ODMS) having different molecular weights were studied.…”

“…Especially, block copolymerization 3-8,11-14,16 -18,20,31,32 based on ODMS, aromatic dianhydride, or with an aromatic diamine as a chain extender has been usually used. Other methods such as the incorporation of siloxane groups into the side chain of the polymer 9,10,25 and polymerization through monomers containing the silicone or siloxane unit 8,15,18 were less explored for the block copolymerization.…”