Polymer materials often experience micro-cracks during their service. Self-healing polymeric materials have the built-in capability to substantially recover their load transferring ability after damage. This field of self-healing materials is a relatively new one, beginning in the early 1990s, with the majority of the research occurring in the past decade [1,2]. The ring-opening metathesis polymerization of dicyclopentadiene (DCPD) [3,4], addition and ionic polymerization of epoxy [5], condensation polymerization of polysiloxane [6], organic solvents [7] and isocyanates [8], have been reported for automatically repairing cracks in polymers at room temperature.Several researchers [5,[9][10][11] have successfully measured fatigue-crack propagation in epoxy resins. Brown and coworkers [5,9] investigated the effect of embedded urea-formaldehyde (UF) microcapsules on the monotonic fracture properties of a selfhealing epoxy. In addition to providing an efficient mechanism for self-healing, the presence of liquidfilled microcapsules increased the virgin monotonic-fracture toughness of epoxy by up to 127%. The increased toughening was correlated with a change in the fracture plane morphology from mirror-like to hackle markings with subsurface microcracking. The addition of microcapsules to an epoxy matrix significantly increased the resistance to crack growth under dynamic loading conditions. Abstract. The effect of temperature on the fracture behaviour of a microcapsule-loaded epoxy matrix was investigated. Microencapsulated epoxy and mercaptan-derivative healing agents were incorporated into an epoxy matrix to produce a polymer composite capable of self-healing. Maximum fracture loads were measured using the double-torsion method. Thermal aging at 55 and 110°C for 17 hours [hrs] was applied to heal the pre-cracked samples. The addition of microcapsules appeared to increase significantly the load carrying capacity of the epoxy after healing. Once healed, the composites achieved as much as 93-171% of its virgin maximum fracture load at 18, 55 and 110°C. The fracture behavior of the microcapsule-loaded epoxy matrix was influenced by the healing temperature. The high self-healing efficiency may be attributed to the result of the subsurface micro-crack pinning or deviation, and to a stronger microencapsulated epoxy and mercaptanderivative binder than that of the bulk epoxy. The results show that the healing temperature has a significant effect on recovery of load transferring capability after fracture.