Preparation and characterization of surface energy of BPDA-BAPP polyimide

Abstract

The surface properties (water sorption and repellency, adhesion) are closely related to the surface tension of polymer solids. The critical surface tension (γ c ) and surface tension (γ s ) of a polymer solid were estimated by the contact angle method by our quantitative imaging system. BPDA (3,3',4,4'-biphenyl tetracarboxylic dianhydride)-BAPP (1,3-Bis(4-aminophenoxy) propane) polyimide was successfully synthesized. The γ c values were analyzed by a Zisman plot, a Young-Dupré-Good-Girifalco plot, and a log (1+cos θ) vs log γ L plot. The γ s value of BPDA-BAPE polyimide was evaluated using the geometric mean equation and our multiple regression analysis. The calculated values of γ S d (a dispersion component), γ S p (a polar component), γ S h (a hydrogen bonding component), and γ S were 30. 79, 9.32, 0.20, and 40.31 mN·m -1 , respectively. The γ S of BPDA-BAPP polyimide containing both a methylene group and an ether group was larger than that of the polyimide containing only a methylene group.

Changes in Surface Free Energy and Surface Conductivity of Carbon Nanotube/Polyimide Nanocomposite Films Induced by UV Irradiation

“…Russell and his colleagues found that PIs (PMDA-ODA) show an ordered structure near the air surface, exhibiting a locally planar zigzag conformation and enhanced inter-chain packing than in the bulk . Kim calculated values of the surface energy (γ s ) and identified a dispersion component (γ d ), a polar component (γ p ), and a hydrogen bonding component (γ h ), yielding values of 40.31, 30.79, 9.32, and 0.20 mN/m, respectively . Using different approaches, Kim and Ban drew the same conclusion that the imide group is the most polar part in the PI chain.…”

Novel polyimides based on diamine containing thiazole units with thioether linkage and pyridine as pendent group

“…To overwhelm these problems, incorporation of bulky pendent groups and aliphatic units 14,15 and the disruption of their symmetry have been suggested. However, as is well known, introduction of some groups, such as flexible ether and acyclic linkages, to the PI backbones will sacrifice their some advantageous properties, such as thermal stability and mechanical properties.…”

Synthesis and characterization of hybrid films of polyimide and silica hollow spheres

“…[1][2][3] PIs are particularly important for electronic applications such as integrated circuit (IC) chips and semiconductor devices. In these applications, low-dielectric constant (low-k) materials are important in solving problems such as the resistance capacitance time delay, cross-talks, and power dissipation.…”