Preparation and characterization of ultra-thin dicing blades with different bonding properties

Abstract

Ultra-thin dicing blade is usually used to achieve a high precision cutting in semiconductor back-end packaging and assembly. Lots of interactional parameters involving in dicing blade preparation and cutting process bring difficulties to high cutting qualities and good working life of dicing blade. In order to address these problems, this study prepared three kinds of dicing blades and characterized the cutting properties of three dicing blades. It first proposed the abrasive exposure coefficient and tool deviation coefficient to provide parameters for the cutting force model. Then the experimental apparatus was set up to verify the proposed cutting force model. And a series of parameters including feed rate, spindle current, edge chipping coefficient, tool wear amount and grinding performance are used to characterize the comprehensive performance of prepared dicing blades. Finally, the edge morphology was observed under 3D microscope to analysis the hardness of different dicing blades. The theoretical and experimental results indicate that the proposed cutting force model can reflect actual cutting process. There is an inverse proportional function between the shedding of abrasive particles and the hardness of the matrix. The cutting performance of dicing blades is very dependent on the material of workpiece. C-dicing blades presents outstanding comprehensive effects with small chips and good self-sharpening properties.

Static numerical simulation of radial deformation of ultra-thin dicing blade

“…Experiments on grinding grooves of ultra-thin dicing blades have shown that grinding forces are basically constant in the stable grinding stage. 23 Hence, this work considers that the ultra-thin dicing blade is statically balanced in stable grinding groove stage. The grinding force is usually calculated by the sum of all the individual grain forces in grinding area.…”

“…However, it was troublesome to determine the coefficients of these empirical formulas, which required a lot of experiments. Yuan et al 23 proposed a analytical grinding force model basing on failure criterion of brittle materials and considering deviation of cutting width, which total tangential and radial grinding forces of the dicing blade were calculated by the tangential and radial grinding forces of single grain multiply the number of grains participating in cutting. Distributions of grinding forces were also analyzed in some studies.…”

High-Speed Dicing of SiC Wafers with 0.048 mm Diamond Blades via Rolling-Slitting

“…Several researchers have attempted to dice silicon carbide [14][15][16][17][18][19][20][21][22][23][24][25], for example, using a diamond wire sawing [14], coating the blade with metallic glass [15,19], applying laser trimming to the blade or adjusting the binder materials [20,24]. Cvetkovic et al [18] demonstrated the viability of ultra-precision dicing and wire sawing to obtain a high surface quality and minimal edge chipping.…”

“…The conventional commercial procedures for manufacturing diamond dicing blades include powder cold pressing, hot pressing and sintering, grinding and thinning, and internal and external round machining [24,25]. To improve the utilization of the precious silicon carbide substrate, the width of the dicing street is to be narrowed correspondingly, requiring the thickness of the diamond blade to be increasingly thinner.…”