A facile route was introduced to prepare homogeneous silicone resin doped with titanium hybrid with high refractive index (RI). Specifically, the hybrids were obtained from the transesterification of hydroxyl‐phenyl‐vinyl silicone resin and titanium isopropoxide under anhydrous conditions. The structures of hybrid silicone and their corresponding intermediates (hydroxyl‐phenyl‐vinyl silicone) were characterized by nuclear magnetic resonance spectroscopy (1H NMR, 29Si NMR) as well as Fourier transform infrared spectroscopy (FTIR). The hybrids had a transmittance of more than 88% ranging from 450 nm to 800 nm, a high RI of 1.585, and a lower water vapor permeability of 3.58 g /m2.24h. Results from FTIR showed intensity of Ti‐O‐Si bond in hybrid decrease with extended the storage time, but the properties of cured hybrids including optical, mechanical, and gas permeability were not influenced. Compared to chips encapsulated with pure silicone, the luminous efficiency of the chips encapsulated with hybrids was improved from 138.6 lm/W to 156.4 lm/W. The thermal shock and hygrothermal aging test also demonstrated the hybrids had a wide range application in light‐emitting diode (LED) packaging. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47834.