It is shown that large angle grain boundaries are formed in the
Cu2S
film at the intersection of adjacent prismatic
normalCdS
planes and that small angle grain boundaries are formed at the intersection of adjacent prismatic and non‐prismatic
normalCdS
planes and at the intersection of a nonprismatic plane with the basal plane. The large angle grains are formed because the orthorhombic
Cu2S
c‐axis is at most a 2‐fold axis whereas the
normalCdS
axis is a 6‐fold axis. It is shown that the open‐circuit voltage is reduced in the vicinity of these grain boundaries. The small angle grain boundaries form because the effective c/a axis of
Cu2S
is different than the c/a axis of
normalCdS
so that the
Cu2S
is distorted when it is made to conform with the
normalCdS
substrate. The open‐circuit voltage in the vicinity of these grain boundaries did not noticeably decrease. It is also shown that the growth rate and morphology of the
Cu2S
films depend on the orientation and morphology of the
normalCdS
substrate.