1986
DOI: 10.1149/1.2108605
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Preparation and Properties of Sintered CdS Films

Abstract: Polycrystal normalCdS films were prepared by coating normalCdS slurry on amorphous glass substrates and sintering in a nitrogen atmosphere in an attempt to produce films with properties suitable for fabricating all‐polycrystal normalCdS/normalCdTe heterojunction solar cells. The uniformity in microstructure and properties of these films has been correlated with starting particle size, volume percent of normalCdS powder in the slurry, and sintering conditions. The variations of electrical properties as … Show more

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Cited by 19 publications
(9 citation statements)
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“…p-Carboxybenzenediazonium modified Si nanoparticles [171] were used in energy storage purposes. The p-carboxyphenyl-modified Si anodes in Li ion batteries exhibited reversible capacities of 1173 and 527 mA h g -1 at the 1 st and 50 th cycles, much higher than those of bare Si electrodes of only 56 and 62 mA h g -1 , respectively.…”
Section: Semi-conductor Nanoparticlesmentioning
confidence: 99%
“…p-Carboxybenzenediazonium modified Si nanoparticles [171] were used in energy storage purposes. The p-carboxyphenyl-modified Si anodes in Li ion batteries exhibited reversible capacities of 1173 and 527 mA h g -1 at the 1 st and 50 th cycles, much higher than those of bare Si electrodes of only 56 and 62 mA h g -1 , respectively.…”
Section: Semi-conductor Nanoparticlesmentioning
confidence: 99%
“…The increasing value of R 10 suggests that, the sintering process is essentially complete after 30 min. When the sintering continued for more than 30 min, the effect of the chloride escape predominated (Yang and Im, 1986). The increase in resistance manifests itself as an additional series resistor and leads consequently to a decrease in slope k .…”
Section: Resultsmentioning
confidence: 99%
“…Development of R 10 values with increasing sintering time depended (in the range 30‐90 min) on the copper content; at 0.77‐0.86 mg Cu/g of powder the resistivity increased, at 2.2‐2.6 mg Cu/g powder the resistance did not change and at 3.1‐3.2 mg Cu/g powder the resistance decreased. Comparison with the general resistance – sintering time dependence (Yang and Im, 1986) suggests that copper inhibits sintering.…”
Section: Resultsmentioning
confidence: 99%
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