Preparation and research of epoxy modified by carboxyl-terminated polybutylene adipate at room temperature

Luo, Xu; Liu, Yu; Sun, Zhaoyi; Wang, Guorong; Xiao, Jie

doi:10.1039/d2ra02915d

Cited by 8 publications

(4 citation statements)

References 31 publications

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“…The resin matrix prepared by mixing 20 phr E-CTPBA and 100 phr E-51 was named CTPBA/EP. The detailed preparation method is set out in the literature [ 29 ].…”

Section: Experimental Methodsmentioning

confidence: 99%

“…In this paper, bisphenol A epoxy resin (E-51) was used as the research object, phenolic amine (T-31) was used as the curing agent, epoxy-terminated polybutylene adipate (E-CTPBA) was used as the toughening agent (self-made in the laboratory, adding 20 phr, where phr represents the amount of E-51 needed to add per 100 phr; in this paper phr is used as the standard; for the E-CTPBA preparation method see the literature [ 29 ]) and zinc powder was used as a filler. The effects of different amounts of zinc powder on the mechanical properties, bonding properties, thermodynamic properties and medium resistance of carboxyl-terminated polyester/epoxy resin (CTPBA/EP) composites were systematically studied.…”

Section: Introductionmentioning

confidence: 99%

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Enhancement of Mechanical Properties and Bonding Properties of Flake-Zinc-Powder-Modified Epoxy Resin Composites

Luo¹,

Liu²,

Li³

et al. 2022

Polymers

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As a typical brittle material, epoxy resin cannot meet its application requirements in specific fields by only considering a single toughening method. In this paper, the effects of carboxyl-terminated polybutylene adipate (CTPBA) and zinc powder on the mechanical properties, adhesion properties, thermodynamic properties and medium resistance of epoxy resin were studied. A silane coupling agent (KH-550) was used to modify zinc powder. It was found that KH-550 could significantly improve the mechanical properties and bonding properties of epoxy resin, and the modification effect of flake zinc powder (f-Zn) was significantly better than that of spherical zinc powder (s-Zn). When the addition amount of f-Zn was 5 phr, the tensile shear strength and peel strength of the composites reached a maximum value of 13.16 MPa and 0.124 kN/m, respectively, which were 15.95% and 55% higher than those without filler. The tensile strength and impact strength reached a maximum value of 43.09 MPa and 7.09 kJ/m2, respectively, which were 40.54% and 91.11% higher than those without filler. This study provides scientific support for the preparation of f-Zn-modified epoxy resin.

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“…The resin matrix prepared by mixing 20 phr E-CTPBA and 100 phr E-51 was named CTPBA/EP. The detailed preparation method is set out in the literature [ 29 ].…”

Section: Experimental Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Enhancement of Mechanical Properties and Bonding Properties of Flake-Zinc-Powder-Modified Epoxy Resin Composites

Luo¹,

Liu²,

Li³

et al. 2022

Polymers

Self Cite

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“…In early studies [ 109 , 110 ], carboxyl end-seal tougheners and amino end-seal tougheners were widely used to improve the mechanical properties and fracture toughness of epoxy composites in order to enhance the delamination resistance of the composites. However, Marouf [ 111 ] showed that these conventional tougheners reduce the Tg , viscosity, and flexural strength of composites, and are not suitable for electronic packaging material applications.…”

Section: The Most Recent Solutions For Delamination Failurementioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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“…2021 [ 8 ], Lou, X. 2022 [ 23 ], Liu, H. 2022 [ 24 ], Sudprasert, P. 2023 [ 25 ], Yuan, Z. 2022 [ 26 ].…”

Section: Figurementioning

confidence: 99%

Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin

Rong,

Su,

et al. 2024

Polymers

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Specialized epoxy resin, capable of achieving room-temperature profound curing and sustaining prolonged exposure to high-temperature environments, stands as a pivotal material in modern high-end manufacturing sectors including aerospace, marine equipment fabrication, machinery production, and the electronics industry. Herein, a silicon-hybridized epoxy resin, amenable to room-temperature curing and designed for high-temperature applications, was synthesized using a sol–gel methodology with silicate esters and silane coupling agents serving as silicon sources. Resin characterization indicates a uniform distribution of silicon elements in the obtained silicon hybrid epoxy resin. In comparison to the non-hybridized epoxy resin, notable improvements are observed in room-temperature curing performance, heat resistance, and mechanical strength.

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Preparation and research of epoxy modified by carboxyl-terminated polybutylene adipate at room temperature

Abstract: In this study, carboxyl-terminated poly(butylene adipate) (CTPBA) was synthesized, which was terminated with epoxy and used as a toughening agent to modify the epoxy resin, and the modified epoxy resin was cured at room temperature.

Cited by 8 publications

References 31 publications

Enhancement of Mechanical Properties and Bonding Properties of Flake-Zinc-Powder-Modified Epoxy Resin Composites

Enhancement of Mechanical Properties and Bonding Properties of Flake-Zinc-Powder-Modified Epoxy Resin Composites

Delamination of Plasticized Devices in Dynamic Service Environments

Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin

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