Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

Rao, B.S.; Sireesha, R; Pasala, AR

doi:10.1002/pi.1808

Cited by 13 publications

(16 citation statements)

References 31 publications

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“…Synthesized monomer, homopolymers and copolymers [HBMBS], [CBMBS-A] and [CBMBS-B] are characterized and structures are confirmed from FT-IR, 1 H NMR spectral analysis.Synthesized polymer compounds were screened out for anti-fungal activity. All polymer compounds showed good anti-fungal activity against the fungalstrains compared to the standard drug Griseofulvin.…”

Section: Resultsmentioning

confidence: 99%

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Bismaleimide-Sulfonamide Homopolymer and Copolymers: Synthesis, Characterization and Microbial Analysis

2017

Chem Sci Trans

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The new bismaleimide monomer N,N'-bis(maleimide)benzenesulfonamide [BMBS], homopolymer N,N'-bis(maleimide)benzenesulfonamide[HBMBS] and copolymers-N,N'-bis(maleimide)benzenesulfonamide-vinyl acetate [CBMBS-A] and N,N'-bis(maleimide)benzene sulfonamide-ethyl vinyl acetate [CBMBS-B] were formed by addition reaction followed by dehydration -cum-cyclization of 4-amino sulfonamide and maleic anhydride. Polymerization process was accompanied by AIBN-THF free radical initiator-solvent selected by trying of many initiatorsolvent system. Melting points were determined by open capillaries method and compounds structures were confirmed from FT-IR spectra (KBr) spectrophotometer. 1 H NMR spectra of all compounds were recorded, using TMS as internal reference. Antifungal activity were examined by various fungus-strain of Candida albicans, Alternaria soloni and Aspergillus niger and results were compared with Griseofulvin as standard reference anti-fungal drug.

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Section: Resultsmentioning

confidence: 99%

“…), 1304 cm -1 (C-N-C), 1336 cm -1 asym and 1162 cm -1 sym. (S=O stre., Sulfonamide), 909 cm -1 (C-H bending), 837 cm -1 (C-H bending, Aromatic for 1,4 disubstitutions); 1 Step 1: …”

Section: Synthesis and Characterization Of Nn'-bis(maleimide)benzenementioning

confidence: 99%

Bismaleimide-Sulfonamide Homopolymer and Copolymers: Synthesis, Characterization and Microbial Analysis

2017

Chem Sci Trans

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“…In order to enhance the toughness of BMI resins without sacrificing the excellent thermal properties, some long-chain structure BMI resins are synthesized. 1,4,19 These BMI resins showed well performance on the mechanical properties, especially the fracture toughness of the cured resins, without significant reducing the heat resistance of the modified resins. 15 In this article, a mixed BMI resin system consisting of BDM, bis[4-(4-maleimidephen-oxy)phenyl)]propane (BMPP), and DABPA were studied.…”

Section: Introductionmentioning

confidence: 97%

“…Inorganic nanoparticles and whiskers are also used as flexibilizers to enhance fracture toughness of BMI resins. In order to enhance the toughness of BMI resins without sacrificing the excellent thermal properties, some long‐chain structure BMI resins are synthesized . These BMI resins showed well performance on the mechanical properties, especially the fracture toughness of the cured resins, without significant reducing the heat resistance of the modified resins …”

Section: Introductionmentioning

confidence: 99%

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

Zhao

Wang

et al. 2014

J of Applied Polymer Sci

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In this article, 2,2′‐bis[4‐(4‐maleimidephen‐oxy)phenyl)]propane (BMPP) resin and N,N‐4,4′‐bismaleimidodiphenylmethyene (BDM) resin blends were modified by diallyl bisphenol A (DABPA). The effects of the mole concentration of BMPP on mechanical properties, fracture toughness, and heat resistance of the modified resins were investigated. Scanning electron microscopy was used to study the microstructure of the fractured modified resins. The introduction of BMPP resin improves the fracture toughness and impact strength of the cured resins, whose thermal stabilities are hardly affected. Dynamic mechanical analysis shows that the modified resins can maintain good mechanical properties at 270.0°C, and their glass transition temperatures (Tg) are above 280.0°C. When the mole ratio of BDM : BMPP is 2 : 1(Code 3), the cured resin performs excellent thermal stability and mechanical property. Its Tg is 298°C, and the Charpy impact strength is 20.46 KJ/m2. The plane strain critical stress intensity factor (KIC) is 1.21 MPa·m0.5 and the plane strain critical strain energy release rate (GIC) is 295.64 J/m2. Compared with that of BDM/DABPA system, the KIC and GIC values of Code 3 are improved by 34.07% and 68.10%, respectively, which show that the modified resin presented good fracture toughness. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014, 131, 40395.

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“…For these reason, modifications of epoxy resins or curing agents in both the backbone and pendant groups have been continuously investigated to improve the thermal and physical properties of cured epoxy resins. Many studies have been reported that improved the heat resistance of epoxy resins by increasing the crosslink density of the cured epoxy resin3 or by introducing bulky structures, such as dicyclopentadiene,4 biphenyl,5, 6 naphthalene,7, 8 fluorine, or maleimide 9–11…”

Section: Introductionmentioning

confidence: 99%

Novel macromolecular epoxy resin curing agent containing biphenyl and maleimide moieties: Preparation, curing kinetics, and thermal properties of its cured polymer

Guo

Xia

Xiong

et al. 2011

J of Applied Polymer Sci

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A new curing agent containing maleimide and biphenyl moieties (MIBP) was synthesized by the condensation polymerization of 4,4′‐bismethoxymethylbiphenyl and N‐(4‐hydroxyphenyl)maleimide (HPM). The chemical structure was characterized with Fourier transform infrared (FTIR) spectroscopy, and the molecular weight of the new curing agent was determined by gel permeation chromatography. Curing reactions of O‐cresol formaldehyde epoxy (CNE) resin with MIBP were investigated under nonisothermal differential scanning calorimetry, and the exotherm exhibited two overlapping exothermic peaks during the curing process; this was demonstrated by FTIR traces. The Flynn–Wall–Ozawa and Friedman methods were used to examine the kinetic parameters and the kinetic models of the curing processes of the CNE/MIBP mixtures. Both reactions turned out to be nth‐order curing mechanisms. Values of the reaction order (n) = 1.42 and activation energy (Ea) = 91.2 kJ/mol were obtained for the first reaction of the curing of the CNE/MIBP system, and values of n = 1.11 and Ea = 78.7 kJ/mol were obtained for the second reaction. The thermal properties of the cured resin were measured with thermogravimetric analysis, and the results show a high glass‐transition temperature (Tg = 155°C), good thermal stability (temperature at 10% weight loss, under nitrogen and in air, ≈ 400 and 408°C, respectively), and high char yield (temperature = 800°C, char residue = 44.5% under nitrogen). These excellent thermal properties were due to the introduction of the maleimide and biphenyl groups of MIBP into the polymer structure. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

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Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimide

Cited by 13 publications

References 31 publications

Bismaleimide-Sulfonamide Homopolymer and Copolymers: Synthesis, Characterization and Microbial Analysis

Bismaleimide-Sulfonamide Homopolymer and Copolymers: Synthesis, Characterization and Microbial Analysis

Bis[4‐(4‐maleimidephen‐oxy)phenyl]propane/N,N‐4,4′‐bismaleimidodiphenylmethyene blend modified with diallyl bisphenol A

Novel macromolecular epoxy resin curing agent containing biphenyl and maleimide moieties: Preparation, curing kinetics, and thermal properties of its cured polymer

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