An epoxypropoxypropyl terminated polydimethylsiloxane (DMS‐E09) is blended with a commercial epoxy resin [diglycidyl ether of bisphenol‐A (DGEBA)], using methyl tetrahydrophthalic anhydride as a curing agent in the presence of the accelerator N, N‐dimethyl benzyl amine. The co‐curing behaviors, glass‐transition temperature (Tg) are studied by differential scanning calorimetry (DSC) and curing kinetic parameters are calculated by Kissinger and Ozawa methods. It is found that the apparent activation energy for DMS‐E09 is slightly lower than that of the DGEBA by 9–10 kJ mol−1. Dynamic mechanical analysis is subsequently employed and reveals that the value of Tg (peak of tan δ at higher temperature) consists with the result of DSC very well. With the increase of DMS‐E09 content, storage modulus and the values of Tg and Tβ (peak of tan δ at lower temperature) all have a tendency of decreasing monotonically. Furthermore, Tg and Tβ follow Fox and Gordon‐Taylor expression well, indicating compatible networks in certain level are obtained. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46891.