Preparation, Mechanical and Electrical Properties of Glass and Jute–Epoxy/Epoxy Polyurethane Composites

Adroja, Pooja P.; Koradiya, S. B.; Patel, J. P.; Parsania, P. H.

doi:10.1080/03602559.2011.553860

Cited by 16 publications

(8 citation statements)

References 25 publications

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“…A considerable amount of residue (34–56%) at 600°C confirmed the formation of highly thermally stable cross‐linked products, which may further degrade at elevated temperatures. Large and negative magnitudes of ∆ S * indicated that transition states are more in an orderly state than individual resin molecules …”

Section: Resultsmentioning

confidence: 99%

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Studies on Bismaleamic Acids Cured Tetrafunctional Epoxy Resin of Bisphenol‐C and Glass‐Epoxy Composites

2014

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The tetrafunctional epoxy resin of bisphenol-C was cured using bismaleamic acids of maleicanhydride and 4,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylether, and 4,4'-diaminodiphenylmethane and characterized by infrared, differential scanning calorimetric, and thermogravimetric analysis. Cured resins showed endothermic transition at about 229-248°C, which supplemented decomposition reactions. Cured resins are thermally stable up to about 200-230°C and followed two-step decomposition reactions. A 34-56% residue at 600°C supplemented the formation of highly thermally stable cross-linked products. Glass composites showed 133-153 MPa tensile strength, 223-290 MPa flexural strength, 7520-8015 MPa flexural modulus, 33-38 kg m −2 impact strength, 37-40 Barcol hardness, 8.3-12.3 kV mm −1 electric strength, 8.9 × 10 12 to 4.2 × 10 14 ohm cm volume resistivity, and 13-14% water absorption. Good thermal, mechanical and electrical properties and excellent hydrolytic stability of the glass composites signify their industrial importance for low load bearing housing, electrical, and marine applications. C

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Section: Resultsmentioning

confidence: 99%

“…[31][32][33][34][35][36] are mainly governed by the type of reinforcement, matrix, and interfacial bond strength. The degradation may result in the formation of free radicals, which may further undergo recombination and degrade at high temperatures.…”

Section: Table II Thermal Kinetic Parameters Of G-ebcf-madds G-ebcf-mentioning

confidence: 99%

Studies on Bismaleamic Acids Cured Tetrafunctional Epoxy Resin of Bisphenol‐C and Glass‐Epoxy Composites

2014

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“…EBCF decomposed completely into low molecular mass substances, while EBCF-MA (37%), EBCF-PMDA (34%), EBCF-PA (26%), EBCF-THPA (21%), EBCF-TBPA (30%), and EBCF-TCPA (53%) showed a considerable amount of residue at 700 ∘ C confirming the formation of highly thermally stable crosslinked product, which may further degrade at elevated temperatures. Large and negative magnitudes of Δ * indicated that transition state is more in orderly state than individual resin molecules and vice versa [13,[17][18][19][20][21][22]. Thus, both nature and structure of the hardeners affected the thermal behavior of the cured resins.…”

Section: Resultsmentioning

confidence: 99%

Thermal Study of Anhydrides Cured Tetrafunctional Cardo Epoxy Resin

Patel

Parsania

2013

Indian Journal of Materials Science

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Tetrafunctional cardo epoxy resin (EBCF) was cured by using 10 wt% maleic anhydride (MA), pyromellitic dianhydride (PMDA), phthalic anhydride (PA), tetrahydrophthalic anhydride (THPA), tetrabromophthalic anhydride (TBPA), and tetrachlorophthalic anhydride (TCPA) as hardeners at 120°C for 40–105 min (gel time) and then postcured 1 h at 130°C. Gel time is found to depend on the structure of the anhydrides used. Cured samples were found insoluble in common solvents. Cured and uncured EBCF were characterized by FTIR, DSC, and TGA techniques. Cured and uncured resins followed multistep degradation reactions. Kinetic parameters, namely, order of degradation, energy of activation, frequency factor, and entropy change, were determined according to the Anderson-Freeman method and interpreted in light of the nature of hardeners used for curing purpose. The resins followed integral or fractional order degradation kinetics. Complex degradation reactions are due to different types of linkages in cured resins. Both nature and structure of resin and hardeners affected the curing behavior and the resultant thermal properties of the cured resins.

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“…1, 1-bis (3-methyl-4-hydroxyphenyl) cyclohexane, 1, 1-bis (3-methyl-4-glycidyloxyphenyl) cyclohexane, organophilic MMT clay and organophilic MMT clay-reinforced epoxy nanocomposites were prepared according to the reported procedures [19][20][21][22]. and 2 moles of acrylic acid were mixed in a round-bottomed flask at 70 C for 4 h with constant stirring to obtain a vinyl ester monomer [23][24][25]. The reactions involved for the preparation of vinyl ester monomer are given in Scheme 1.…”

Section: Methodsmentioning

confidence: 99%

Organoclay-Filled Vinyl Ester Monomer Toughened Epoxy-Intercrosslinked Matrix Materials

Chandramohan

Vengatesan

Devaraju

et al. 2013

International Journal of Polymeric Materials and Polymeric Biom

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A vinyl ester monomer (VEM), namely cyclohexyl-1,1 0 -bis[4-(c-2-methylphenoxy)-a-hydroxypropylacrylate], was synthesized from 1, 1-bis (3-methyl-4-glycidyloxyphenyl) cyclohexane, and acrylic acid via nucleophilic addition. The structure of VEM was confirmed by FTIR, 1 H, 13 C NMR, and electron impact-mass spectroscopy. Diglycidyl ethers of bisphenol-A (DGEBA) epoxy resin were toughened with varying percentages of 5, 10, and 15% (by wt) VEM using 4, 4 0 -diaminodiphenylmethane (DDM). VEM-modified epoxy systems were further modified with organophilic montmorillonite (OMMT) clay. OMMT clay-filled hybrid VEM-epoxy resin systems, developed in the form of casting, were characterized for their mechanical, thermomechanical, dielectric, and morphological properties.

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Preparation, Mechanical and Electrical Properties of Glass and Jute–Epoxy/Epoxy Polyurethane Composites

Cited by 16 publications

References 25 publications

Studies on Bismaleamic Acids Cured Tetrafunctional Epoxy Resin of Bisphenol‐C and Glass‐Epoxy Composites

Studies on Bismaleamic Acids Cured Tetrafunctional Epoxy Resin of Bisphenol‐C and Glass‐Epoxy Composites

Thermal Study of Anhydrides Cured Tetrafunctional Cardo Epoxy Resin

Organoclay-Filled Vinyl Ester Monomer Toughened Epoxy-Intercrosslinked Matrix Materials

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