2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897490
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Preparation of a Micro Rubidium vapor cell and its integration in a chip-scale atomic magnetometer

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Cited by 5 publications
(2 citation statements)
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“…In 2014, Ji et al of Southeast University prepared a wafer-level spherical rubidium vapor cell by utilizing a combination of high-temperature thermoforming and a releasing agent [63], which first etched a hole array on a silicon wafer by utilizing dry etching and was then filled with an initiator for the first anodic bonding to produce a spherical vapor cell; then, a cavity array was etched by utilizing dry etching again, and it was finally filled with alkali metal atoms and buffer gas under vacuum and the second anodic bonding was performed to achieve a sealed vapor cell. The size of the alkali vapor cell reached 3 × 3 × 2 mm 3 .…”
Section: Direct Filling Methods Of Alkali Metal Elements In the Physi...mentioning
confidence: 99%
“…In 2014, Ji et al of Southeast University prepared a wafer-level spherical rubidium vapor cell by utilizing a combination of high-temperature thermoforming and a releasing agent [63], which first etched a hole array on a silicon wafer by utilizing dry etching and was then filled with an initiator for the first anodic bonding to produce a spherical vapor cell; then, a cavity array was etched by utilizing dry etching again, and it was finally filled with alkali metal atoms and buffer gas under vacuum and the second anodic bonding was performed to achieve a sealed vapor cell. The size of the alkali vapor cell reached 3 × 3 × 2 mm 3 .…”
Section: Direct Filling Methods Of Alkali Metal Elements In the Physi...mentioning
confidence: 99%
“…In this paper, based on the previous research [21], [22], a novel wafer-level all-glass hermetic or vacuum packaging methodology was proposed for alkali vapor cells of atomic devices to enhance the environmental stability of the microalkali vapor cells. The upper half part of the package was wafer-level hemispherical glass bubble arrays prepared by a controllable process combining a hot forming process and a chemical foaming process (CFP) [20], [25].…”
Section: Introductionmentioning
confidence: 99%