Preparation of a one-component epoxy adhesive using PET bottle waste derived terephthalic dihydrazide as latent curing agent

George, Neena; Sharmila, T.K. Bindu; Kurian, Thomas

doi:10.1016/j.ijadhadh.2019.102524

Cited by 12 publications

(9 citation statements)

References 6 publications

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“…The latent curing epoxy system needs to be stable for a long time as a composite matrix, and at the same time, it must be fast cured when operating in the field. Therefore, the storage stability and curing behavior of the one‐component EP curing system must be studied 32 . In this work, an aging test was carried out, and the storage time of EP/17.5 wt% BTD‐MZ 2 and EP/7.2 wt% 2E4MMZ at different temperatures is simulated by a MCR, which is defined as the time when the initial viscosity doubles.…”

Section: Resultsmentioning

confidence: 99%

“…Therefore, the storage stability and curing behavior of the one-component EP curing system must be studied. 32 In this work, an aging test was carried out, and the storage time of EP/17.5 wt% BTD-MZ 2 and EP/7.2 wt% 2E4MMZ at different temperatures is simulated by a MCR, which is defined as the time when the initial viscosity doubles. And we simulate the curing process of EP/17.5 wt% BTD-MZ 2 and EP/7.2 wt% 2E4MMZ under dynamic conditions at a heating rate of 5 C min À1À1 .…”

Section: Thermal Properties Of Ep/xwt% Btd-mz 2 and Ep/72 Wt% 2e4mmz ...mentioning

confidence: 99%

“…Therefore, latent curing agent was developed to overcome the storage stability and rapid curing of onecomponent EP curing system. 23,[27][28][29][30][31][32][33] So far, encapsulation of the imidazole derivatives and introduction of inhibitory activity group into the position 1 of imidazole have been proven as efficient methods for developing imidazole-based latent curing agents. Xing et al 34 prepared a spherical latent microcapsule curing agent, curing reaction in 3 h to complete, as long as 100 days of storage time at room temperature.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, shortening the curing period of thermosetting resin is also the key to manufacture resin matrix composites efficiently. Therefore, latent curing agent was developed to overcome the storage stability and rapid curing of one‐component EP curing system 23,27–33 . So far, encapsulation of the imidazole derivatives and introduction of inhibitory activity group into the position 1 of imidazole have been proven as efficient methods for developing imidazole‐based latent curing agents.…”

Section: Introductionmentioning

confidence: 99%

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Imidazole substituted benzothiadiazole derivatives as latent curing agent for epoxy thermosetting resin

Zhang

Guo

et al. 2022

J of Applied Polymer Sci

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As an important thermosetting resin, epoxy resin (EP) is widely used in the field of composite materials. Long storage time, rapid curing and low viscosity of one-component EP is ideal for preparing composite materials by vacuum assisted resin transfer molding (VARTM). For this sake, we developed and synthesized a new imidazole thermal latent curing agent, 4,7-diimidazol-2,1,3-benzothiadiazole (BTD-MZ 2 ) with a yield of about 75%. The curing behavior, thermal stability and storage time of the prepared EP system was studied by differential scanning calorimeter (DSC), thermal gravimetric analyzer (TGA), modular compact rheometer (MCR), respectively. DSC results showed that EP/17.5 wt% BTD-MZ 2 had a good latent period at low temperature, and can rapidly cure EP when heated to 150 C. TGA results show that BTD-MZ 2 promoted the formation of carbon residue and the residual carbon rate of EP/17.5 wt% BTD-MZ 2 is as high as 37.9%. MCR results show that the storage time of EP/17.5 wt% BTD-MZ 2 at 60 C can reach 850 min. In addition, it could play a role of catalyst used as co-curing agents with aromatic amines for EP. DSC test showed that the addition of 5 wt% BTD-MZ 2 reduced the activation energy of EP/4,4 0 -diaminodiphenylmethane (DDM) and promoted the curing reaction.

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Section: Resultsmentioning

confidence: 99%

Section: Thermal Properties Of Ep/xwt% Btd-mz 2 and Ep/72 Wt% 2e4mmz ...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Imidazole substituted benzothiadiazole derivatives as latent curing agent for epoxy thermosetting resin

Zhang

Guo

et al. 2022

J of Applied Polymer Sci

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“…In some new proposed formulations of one-component diglycidyl ether of bis-phenol A (DGEBA) based epoxy resin, a derivate of terephthalic dihydrazide (TDH) obtained from PET bottle waste was used as curing agent. The idea was to reduce the curing time of the epoxy adhesive in structural bonding of aluminum to aluminum (Al/Al) [ 100 ]. This approach was well succeeded in the replacement of dicyandiamide, since it led to comparable properties of commercial epoxy formulation of the structural adhesive in which dicyandiamide is used instead of TDH.…”

Section: Eco-friendly Emergent Structural Adhesivesmentioning

confidence: 99%

Review on Adhesives and Surface Treatments for Structural Applications: Recent Developments on Sustainability and Implementation for Metal and Composite Substrates

et al. 2020

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Using adhesives for connection technology has many benefits. It is cost-efficient, fast, and allows homogeneous stress distribution between the bonded surfaces. This paper gives an overview on the current state of knowledge regarding the technologically important area of adhesive materials, as well as on emergent related technologies. It is expected to fill some of the technological gaps between the existing literature and industrial reality, by focusing at opportunities and challenges in the adhesives sector, on sustainable and eco-friendly chemistries that enable bio-derived adhesives, recycling and debonding, as well as giving a brief overview on the surface treatment approaches involved in the adhesive application process, with major focus on metal and polymer matrix composites. Finally, some thoughts on the connection between research and development (R&D) efforts, industry standards and regulatory aspects are given. It contributes to bridge the gap between industry and research institutes/academy. Examples from the aeronautics industry are often used since many technological advances in this industry are innovation precursors for other industries. This paper is mainly addressed to chemists, materials scientists, materials engineers, and decision-makers.

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Preparation of low‐temperature curing single‐component epoxy adhesives with sedimentation coated accelerators

Zhao,

Pan,

Han

et al. 2024

J of Applied Polymer Sci

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Single‐component epoxy adhesives are widely used in various fields due to their simple operation process and excellent bonding properties. However, the excessively high curing temperature of the traditional single‐component epoxy adhesives may easily damage the electronic devices, limiting their further application. Hence, it is of great significance to develop the low‐temperature‐curing single‐component epoxy adhesives. However, the room temperature storage stability of low‐temperature curing system is generally poor. This work selected epoxy resin (EPON‐828), pentaerythritol tetra (3‐mercaptopropionate) (PETMP), 1‐benzylimidazole (1‐BMZ), and stabilizer (salicylic acid) as materials to prepare low‐temperature curing single‐component epoxy adhesives. In order to improve the storage stability of the system, polycarbonate (PCM‐A‐37) with low molecular weight was employed to coat the accelerator 1‐BMZ by physical sedimentation. The results showed that the room temperature storage period of the system reached 140 h, which was 2.18 times longer than before coating, and the curing temperature of 75°C was determined through DSC curves fitting. The epoxy adhesives have been completely cured at 75°C for 5 h, and shear strength reached 10.20 ± 0.51 MPa, which was not significantly different from that of the system with uncoated accelerators. We believe our paradigm can provide a feasible approach for preparing low‐temperature curing single‐component epoxy adhesives, and has reference significance for the preparation of single‐component adhesives in other systems, too.

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Preparation of a one-component epoxy adhesive using PET bottle waste derived terephthalic dihydrazide as latent curing agent

Cited by 12 publications

References 6 publications

Imidazole substituted benzothiadiazole derivatives as latent curing agent for epoxy thermosetting resin

Imidazole substituted benzothiadiazole derivatives as latent curing agent for epoxy thermosetting resin

Review on Adhesives and Surface Treatments for Structural Applications: Recent Developments on Sustainability and Implementation for Metal and Composite Substrates

Preparation of low‐temperature curing single‐component epoxy adhesives with sedimentation coated accelerators

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