1995
DOI: 10.5104/jiep1995.10.148
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Preparation of Conductive Particles by Using Electroless Plating.

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“…Smooth and pit-free electroless Ni-P deposits were obtained by adding 150 ppm of sodium dodecyl sulfate (SDS) to the electroless nickel bath [5]. Similarly, a very brief conclusion was derived by Hagiwara et al [6] as well, who studied the effect of three different surfactants added in the Ni-P electroless bath on the 2 Advances in Tribology morphology of the resulting Ni-P particles. Many attempts have been made to find out the effect of surfactants on the roughness of electrodeposited Ni-P coatings.…”
Section: Introductionmentioning
confidence: 99%
“…Smooth and pit-free electroless Ni-P deposits were obtained by adding 150 ppm of sodium dodecyl sulfate (SDS) to the electroless nickel bath [5]. Similarly, a very brief conclusion was derived by Hagiwara et al [6] as well, who studied the effect of three different surfactants added in the Ni-P electroless bath on the 2 Advances in Tribology morphology of the resulting Ni-P particles. Many attempts have been made to find out the effect of surfactants on the roughness of electrodeposited Ni-P coatings.…”
Section: Introductionmentioning
confidence: 99%