Preparation of copper thermal interface materials by laser method

Jiang, Weiwei; Wu, Yingbin; Li, Xudong; Na, Zhaolin; Sun, Wenping; Yu, Huimin

doi:10.1109/icept56209.2022.9872651

Cited by 1 publication

(1 citation statement)

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“…A recent study demonstrated a laser beam method to directly bond Cu foil to an electronic chip. [ 21 ] The Cu foil locally melted by the laser beam irradiation, and the molten droplets were bonded to the chip. Despite the enhanced adhesion between the Cu foil and chip, the high‐power laser beam irradiation limits practical applications.…”

Section: Introductionmentioning

confidence: 99%

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

Alayli,

Kim,

Cheon

et al. 2023

Adv Eng Mater

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Low‐cost thermal interface materials with high thermal conductivity (κ) and low total thermal resistance (Rt) receive considerable attention for thermal management. A copper film (CuFilm) is an excellent candidate due to the high κ (364 Wm−1 K−1) it possesses. However, the practical implementation is hindered by its high elastic modulus (Es = 70.8 GPa), inducing a high contact thermal resistance (Rc = 91.6 mm2 K W−1). Herein, the selective construction of electrically conducting or insulating layers on CuFilm to dramatically decrease Es, Rc, and Rt is reported. The highly electrically and thermally conducting layer is synthesized by incorporating in situ reduced copper nanoparticles (CuNPs, 35 vol%) and multiwalled carbon nanotubes embellished with CuNPs (1.5 vol%) in polyethylene glycol. The high effective κ (92.7 Wm−1 K−1) still maintains a low specimen thermal resistance (Rs = 4.9 mm2 K W−1), while the dramatically softened surface (Es = 5.7 GPa) decreases Rc (8.3 mm2 K W−1), resulting in a very small Rt (13.2 mm2 K W−1). Alternatively, the electrically insulating but thermally conducting layer is constructed using aluminum nitride particles. The κ is still high (72.1 Wm−1 K−1) with a small Rt (47.5 mm2 K W−1). The facile fabrication based on a CuFilm enables cost‐effective thermal interface materials with tunable electrical and thermal properties.

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Section: Introductionmentioning

confidence: 99%