2023
DOI: 10.1111/jace.19219
|View full text |Cite
|
Sign up to set email alerts
|

Preparation of h‐BN microspheres for nanocomposites with high through‐plane thermal conductivity

Abstract: In recent times, electronics have been increasingly minimized, and hence, heat dissipation has become essential. Owing to its high thermal conductivity and superior electrical insulation, hexagonal‐boron nitride (h‐BN) has been regarded as an appropriate ceramic material to increase the thermal conductivity of polymer nanocomposites for effective heat dissipation. However, the poor through‐plane thermal conductivity of h‐BN severely restricts its practical uses, and it is favorable for heat to radiates in the … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 12 publications
(3 citation statements)
references
References 58 publications
0
3
0
Order By: Relevance
“…As early as 1988, h-BN particles were used as fillers to improve the TC of polymers, which resulted in a relatively objective improvement of 11.7 times compared to the matrix [ 20 , 153 ]. Compared with multidimensional h-BN, 0D h-BN has unique advantages for reducing the viscosity of composites, achieving high levels of filling, and constructing isotropic composites [ 154 , 155 ]. Liu et al prepared hollow h-BN microspheres (BNMSs) with a diameter of 0.8–3.4 μm through a chemical vapor deposition process involving trimethyl borate and ammonia.…”
Section: The Development Of Thermal Conduction Network Of H-bnmentioning
confidence: 99%
“…As early as 1988, h-BN particles were used as fillers to improve the TC of polymers, which resulted in a relatively objective improvement of 11.7 times compared to the matrix [ 20 , 153 ]. Compared with multidimensional h-BN, 0D h-BN has unique advantages for reducing the viscosity of composites, achieving high levels of filling, and constructing isotropic composites [ 154 , 155 ]. Liu et al prepared hollow h-BN microspheres (BNMSs) with a diameter of 0.8–3.4 μm through a chemical vapor deposition process involving trimethyl borate and ammonia.…”
Section: The Development Of Thermal Conduction Network Of H-bnmentioning
confidence: 99%
“…14−17 However, traditional polymer materials have low thermal conductivity, which is not conducive to the rapid dissipation of heat energy, thus hindering their practical use as thermal management materials. An effective combination of polymers and highly thermally conductive fillers such as boron nitride (BN), 18 graphene, 19 and silicon carbide (SiC) 20 is considered to be an ideal solution. 21−23 In addition, thermally conductive fillers should maintain the processability, lightness, and electrical insulation of the composite as much as possible.…”
Section: Introductionmentioning
confidence: 99%
“…Polymer materials exhibit strong designability of the molecular chain structure, good processing performance, and corrosion resistance. Polyimides, due to their outstanding high-temperature resistance, dielectric properties, and excellent radiation resistance, have found extensive applications in the microelectronics industry, particularly in large-scale and very-large-scale integrated circuits, as functional materials. However, traditional polymer materials have low thermal conductivity, which is not conducive to the rapid dissipation of heat energy, thus hindering their practical use as thermal management materials. An effective combination of polymers and highly thermally conductive fillers such as boron nitride (BN), graphene, and silicon carbide (SiC) is considered to be an ideal solution. In addition, thermally conductive fillers should maintain the processability, lightness, and electrical insulation of the composite as much as possible. Among them, boron nitride nanosheets (BNNS) show a hexagonal crystal structure similar to graphite and are the promising thermal conductive filler because of its high thermal conductivity, which is the best thermal conductivity among ceramic materials, together with high insulation, high heat resistance, and good mechanical properties. Considering these advantages of BNNS, it is believed that high thermal conductivity could be obtained by constructing orderly and continuously interconnected BNNS structures in composite materials, so many researchers have improved the thermal conductivity of the material by introducing BNNS . Nevertheless, most strategies to improve thermal conductivity by incorporating thermally conductive fillers will inevitably sacrifice the mechanical property and flexibility. Especially under high filler loading, it will lead to poor processing ability and severe deterioration of the mechanical properties of composites, which limits their potential applications. , Accordingly, constructing an effective thermal conduction path with a minimum filler content through structural manipulation is extremely critical and also remains a great challenge.…”
Section: Introductionmentioning
confidence: 99%