Preparation of high thermal conductive aluminum nitride/cyanate ester nanocomposite using a new macromolecular coupling agent

Abstract

Novel glycidyl methacrylate–butyl acrylate–maleic anhydride (GBM) terpolymers with different molecular weights were synthesized by radical polymerization and characterized using fourier transform infrared, nuclear magnetic resonance (1H‐NMR and 13 C‐NMR), and gel permeation chromatography. Each GBM terpolymer was used to modify aluminum nitride (AlN), and the modified AlN, coded as AlN(GBM), was added to 2,2′‐bis(4‐cyanatophenyl)isopropylidene (CE) resin for preparing composites. Composites based on original AlN or γ‐(2,3‐epoxypropoxy)propyltrimethoxysilane‐modified AlN (AlN(K)) were also prepared for comparison. Although GBM and γ‐(2,3‐epoxypropoxy)propyltrimethoxysilane have similar reactive groups, the results indicate that GBM shows more attractive integrated advantages, reflected by the fact that CE/AlN(GBM) composites have better thermal stability, higher thermal conductivity, and higher glass transition temperature than those of CE/AlN(K). These properties result from better dispersion of fillers, improved interfacial adhesion between fillers and CE resin, and increased cross‐linking density. This study demonstrates that the nature of the coupling agents is an important factor to develop high performance composites for cutting‐edge industries. Copyright © 2011 John Wiley & Sons, Ltd.

Self-repair of structural and functional composites with intrinsically self-healing polymer matrices: A review

“…The adhesion at the interface between the polymer matrix and the fillers is essential to the thermal conductivity of composites. Many studies showed that the surface treatment with coupling agent can improve the matrix-filler interfacial adhesion, which increases the thermal conductivity of composites [141][142][143]. Thermal boundary resistance (R b ) is a measure of an interface's resistance to thermal flow.…”

Efficient thermal properties enhancement to hyperbranched aromatic polyamide grafted aluminum nitride in epoxy composites

“…To further improve the thermal conductivities of the epoxy polymers, one simple method is to introduce ceramic particles with high thermal conductivity into the matrix. A variety of fillers including alumina (Al 2 O 3 ), [2] aluminum nitride (AlN), [3][4][5] and boron nitride (BN) [6] are chosen for the preparation of high thermal conductivity polymer composites. Among these fillers, AlN nanoparticles have received great attention because of their good physical properties, such as abrasion resistance, corrosion resistance, thermal stability, electrical insulation, and high thermal conductivity.…”

Cyanate Esters

“…Zhang et al [12] prepared a novel substituted biphenyl-based cyanate ester resin (Figure 11.13). The monomer, 4,4 0 -bis(4-cyanatobenzyl)biphenyl (BBPCy) does not contain any phosphorous or halogen atoms and hence, avoids the drawbacks involved with such compounds like, for instance, the generation of toxic fumes upon thermal combustion of halogen-containing compounds.…”

“…12 Chemical structures of the DOPO modified cyanester monomers used by Chang et al[92] (structures a and b) and Lin et al[91] (structure c).OCN NCOFigure 11.13 Chemical structure of 4,4 0 -bis (4-cyanatobenzyl) biphenyl (BBPCy)[12].…”